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[(η2-(4-trimethylsilyl-2-methyl-but-1-ene-3-yne))Cu(1,1,1,5,5,5-hexafluoroacetylacetonate)] is a chemical with a specific purpose. Lookchem provides you with multiple data and supplier information of this chemical.

866562-68-7

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866562-68-7 Usage

Check Digit Verification of cas no

The CAS Registry Mumber 866562-68-7 includes 9 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 6 digits, 8,6,6,5,6 and 2 respectively; the second part has 2 digits, 6 and 8 respectively.
Calculate Digit Verification of CAS Registry Number 866562-68:
(8*8)+(7*6)+(6*6)+(5*5)+(4*6)+(3*2)+(2*6)+(1*8)=217
217 % 10 = 7
So 866562-68-7 is a valid CAS Registry Number.

866562-68-7Downstream Products

866562-68-7Relevant academic research and scientific papers

Me3SiC≡C-CMe=CH2 copper(I) β-diketonates: Synthesis, solid state structure, and low-temperature chemical vapour deposition

Shen,Rüffer,Schulz,Gessner,Wittenbecher,Sterzel,Lang

, p. 3878 - 3885 (2005)

The ene-yne copper(I) β-diketonates [(η2-TMSMB) Cu(β-diketonate)] (β-diketonate = acetylacetonate/acac, 5; = 1,3-di-tert-butylacetonate/dbac, 6; = 1,1,1,5,5,5-hexafluoroacetylacetonate/ hfac, 7; TMSMB = 4-TriMethylSilyl-2-Methyl-But-1-ene-3-yne, Me 3SiCC-CMeCH2) are accessible by the reaction of [(η2-TMSMB)Cu(μ-Cl)]2 (3) with [Na(β- diketonate)] (β-diketonate = acac, 4a; = dbac, 4b; = hfac, 4c) in a 1:2 molar ratio. Complexes 6 and 7 are also formed, when Cu2O (8) is reacted with H-hfac (9a) or H-dbac (9b), respectively. The solid state structure of 7 is reported. The copper(I) ion possesses a planar environment caused by the η2-coordinated TMSMB ligand and the chelate-bound hfac group, while the CMeCH2 entity stays free. The thermal properties of 5-7 were determined by applying ThermoGravimetry (TG) and Differential Scanning Calorimetry (DSC). All complexes decompose in a two-step process beginning at ca. 85 °C. Elimination of TMSMB produces [Cu(β-diketonate)] which disproportionates to give [Cu(β-diketonate)2] and elemental copper. Preliminary hot-wall Chemical Vapour Deposition experiments (CVD) were carried out with 7. Copper films were deposited onto TiN-coated oxidised silicon wafers at a precursor vaporisation temperature of 50 °C and a deposition temperature of 145 °C. The films were characterised by SEM and EDX.

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