
Journal of Organometallic Chemistry p. 3878 - 3885 (2005)
Update date:2022-07-31
Topics:
Shen
Rüffer
Schulz
Gessner
Wittenbecher
Sterzel
Lang
The ene-yne copper(I) β-diketonates [(η2-TMSMB) Cu(β-diketonate)] (β-diketonate = acetylacetonate/acac, 5; = 1,3-di-tert-butylacetonate/dbac, 6; = 1,1,1,5,5,5-hexafluoroacetylacetonate/ hfac, 7; TMSMB = 4-TriMethylSilyl-2-Methyl-But-1-ene-3-yne, Me 3SiCC-CMeCH2) are accessible by the reaction of [(η2-TMSMB)Cu(μ-Cl)]2 (3) with [Na(β- diketonate)] (β-diketonate = acac, 4a; = dbac, 4b; = hfac, 4c) in a 1:2 molar ratio. Complexes 6 and 7 are also formed, when Cu2O (8) is reacted with H-hfac (9a) or H-dbac (9b), respectively. The solid state structure of 7 is reported. The copper(I) ion possesses a planar environment caused by the η2-coordinated TMSMB ligand and the chelate-bound hfac group, while the CMeCH2 entity stays free. The thermal properties of 5-7 were determined by applying ThermoGravimetry (TG) and Differential Scanning Calorimetry (DSC). All complexes decompose in a two-step process beginning at ca. 85 °C. Elimination of TMSMB produces [Cu(β-diketonate)] which disproportionates to give [Cu(β-diketonate)2] and elemental copper. Preliminary hot-wall Chemical Vapour Deposition experiments (CVD) were carried out with 7. Copper films were deposited onto TiN-coated oxidised silicon wafers at a precursor vaporisation temperature of 50 °C and a deposition temperature of 145 °C. The films were characterised by SEM and EDX.
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