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| CAS No.: | 24304-00-5 |
|---|---|
| Name: | Aluminum nitride (AlN) |
| Article Data: | 4 |
| Molecular Structure: | |
|
|
|
| Formula: | AlN |
| Molecular Weight: | 46.0279 |
| Synonyms: | Aluminumnitride (8CI);21RAlN;A 100S;A 100WR;A 200 (nitride);A 500FXWR;AGN 1 (nitride);AN 215;AS 10 (nitride);AlN 2;Alnel A 100;Aluminum mononitride;Denka AN Plate;FAN-F 05;FAN-F 30;FAN-f 30A-TY;FAN-f 50J-A;FAN-f 80;FLA;GP 1000;HR 10;JC;MAN 20;R 15;R 15 (nitride);R15S;SCAN 70;SH 02SW10 Type I;SH 15;SH 30;Shapal E;Shapal SH 04;Shapal SH 15;Shapal SH 30;Toyalnite FLA;Toyalnite FLD;Toyalnite FLG;Toyalnite FLX;Toyalnite FS;Toyalnite Super FL;Toyalnite UC;Toyalnite US;UM 53E9;UMS;WR 100;XUR-YM 2002-97923;XUS35548;XUS 35560;XUS 35569;Aluminum nitride; |
| EINECS: | 246-140-8 |
| Density: | 3.26 g/mL at 25 °C(lit.) |
| Melting Point: | >2200 °C(lit.) |
| Boiling Point: | 2517oC |
| Solubility: | may decompose in water |
| Appearance: | sheet or powder |
| Hazard Symbols: |
 Xi
|
| Risk Codes: | 36/37/38 |
| Safety: | 26-37/39 |
| Transport Information: | UN 3178 |
| PSA: | 23.79000 |
| LogP: | 0.24008 |
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Chemistry
Molecular Structure:
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Molecular Formula: AlN
Molecular Weight: 40.9882
IUPAC Name: Azanylidynealumane
Synonyms of Aluminum nitride (CAS NO.24304-00-5): EINECS 246-140-8 ; Aluminum nitride (AlN)
CAS NO: 24304-00-5
Classification Code: Inorganics ; 13: Al ; Ceramics ; Materials Science ; Nanomaterials ; Nanoparticles: Oxides, Nitrides, and Other CeramicsMetal and Ceramic Science ; Nanopowders and Nanoparticle Dispersions ; NitridesNanomaterials ; Metal and Ceramic Science ; Nitrides
Melting point: >2200 °C
History
Aluminum nitride (CAS NO.24304-00-5) was first synthesized in 1877, but it was not until the middle of the 1980s that its potential for application in microelectronics was realized due to its relative high thermal conductivity for an electrical insulating ceramic (70-210 W.m-1.K-1 for polycrystalline material, and as high as 285 W.m-1.K-1 for single crystals)
Uses
Aluminum nitride (CAS NO.24304-00-5) can be used in electronics applications similar to those of Alumina and BeO. It can be used as opto-electronics, dielectric layers in optical storage media, electronic substrates, chip carriers where high thermal conductivity is essential, military applications, as a crucible to grow crystals of GALLIUM arsenide, steel and semiconductor manufacturing.
Production
Aluminum nitride (CAS NO.24304-00-5) is synthesized by the carbothermal reduction of Alumina or by direct nitridation of aluminium. The use of sintering aids and hot pressing is required to produce a dense technical grade material.
Safety Profile
Hazard Codes of Aluminum nitride (CAS NO.24304-00-5): 
Xi
Risk Statements: 36/37/38
R36/37/38: Irritating to eyes, respiratory system and skin.
Safety Statements: 26-37/39
S26: In case of contact with eyes, rinse immediately with plenty of water and seek medical advice.
S37/39: Wear suitable gloves and eye/face protection.
RIDADR: UN3178
WGK Germany: 3
HazardClass: 4.1
PackingGroup: II
Specification
Aluminium nitride (AlN) is a nitride of aluminium. Its wurtzite phase (w-AlN) is a wide band gap (6.01-6.05 eV at room temperature) semiconductor material, giving it potential application for deep ultraviolet optoelectronics.
The temperature is high and the intensity decreases with the temperature.The thermal conductivity is good, the thermal expansion coefficient is small, it is a good heat resistant shock material.Excellent thermal shock resistance.AlN's heat conductivity is two to three times Al2O3, and the heat pressure is higher than Al2O3.Aluminum nitride on Al and other molten metal, such as gallium arsenide has good corrosion resistance, especially for molten Al fluid has excellent corrosion resistance, but also has excellent electrical insulation and dielectric properties.However, the high temperature oxidation resistance of the aluminum nitride, the heat and nitrogen in the atmosphere, the hydrolysis, and the wet air, water, or water containing water, are rapidly decomposed.In the 2516 ℃ decomposition, the hot hardness is very high, even before the decomposition temperature softening deformation.The aluminum and water are hydrolyzed at room temperature.And dry oxygen reaction in above 800 ℃.