12019-61-3Relevant articles and documents
Formation of Cu2SnSe3 from stacked elemental layers investigated by combined in situ X-ray diffraction and differential scanning calorimetry techniques
Wibowo, Rachmat Adhi,Moeckel, Stefan,Yoo, Hyesun,Hoelzing, Astrid,Hock, Rainer,Wellmann, Peter J.
, p. 254 - 258 (2014)
Stacked elemental layers of Mo/Cu/Sn and Mo/Cu/Sn/Se were employed as samples for investigating the formation reaction of Cu-Sn intermetallic compounds as well as Cu2SnSe3 phases by in situ technique of X-ray diffraction and differential scanning calorimetry. The use of a combined in situ technique allows a real-time observation on solid-state reactions as well as any crystalline phase changes during annealing towards the crystallization of Cu2SnSe3. It is found that Cu and Sn form intermetallic compounds of Cu6Sn5, Cu3Sn and Cu41Sn11 as the annealing temperature rises from 30 to 550 C. The reaction of Se with Cu to form a CuSe phase dominates the binary phase formation at a low annealing temperature. The annealing of a stacked Mo/Cu/Sn/Se layer suggests that only Cu6Sn5 intermetallic compound directly acts as a reactant for the Cu-selenide phase formation. A SnSe phase mostly forms from a liquid-state reaction of Sn and Se above the Sn melting point. The in situ investigation also reveals a complete set of Cu-selenide peritectic decompositions of CuSe2 → CuSe → Cu1.8Se at 360 and 412 C. The formation of Cu2SnSe 3 phase starts at 450 C as a product from a reaction between Cu 1.8Se and SnSe in a presence of liquid Se. Comparisons on the initial formation temperatures of all involved phases and on the formation pathways between Cu2SnSe3 and Cu2SnS3 are discussed as well.
Nanocrystalline zintl phases from main-group metal chlorides and magnesium anthracene or activated magnesium
Abraham, Ingo,Aleandri, Lorraine E.,Bogdanovic, Borislav,Kolb, Uwe,Lagarden, Martin,Schlichte, Klaus
, p. 1699 - 1710 (1998)
Ga, Tl, Sn, Pb, As, Sb, Bi, Cd, and Hg chlorides react with magnesium anthracene · 3 THF (MgA), anthracene-activated magnesium, or active magnesium (Mg*) in THF, generating the respective Mg intermetallics in a nanocrystalline or amorphous state (Eqs. 1-3). Mg intermetallics accessible through the wet-chemical route can be exploited by metathetical exchange reactions for the preparation of other, highly active intermetallics and alloys; EXAFS investigation of X-ray amorphous Cu-Sn and Pd-Pb solids thus prepared (Eqs. 13 and 14) shows that they are true bimetallic alloys (solid solutions).
Electrochemical alloying of copper substrate with tin using ionic liquid as an electrolyte at medium-low temperatures
Murase, Kuniaki,Kurosaki, Ryoichi,Katase, Takuma,Sugimura, Hiroyuki,Hirato, Tetsuji,Awakura, Yasuhiro
, p. D612-D616 (2007)
Electrochemical alloying of Cu substrates through a reduction-diffusion method was investigated using an ionic liquid, trimethyl- n -hexylammonium bis[(trifluoromethyl)sulfonyl]amide, as a solvent for an electrolytic bath. The use of the ionic liquid made it possible to raise the processing temperature beyond 100°C and form the Cu-Sn layers faster than with an aqueous media. The layers obtained from a Cu thin layer under a potentiostatic condition were silver-gray speculum metal composed of Cu6 Sn5, Cu3 Sn, and Cu10 Sn3 intermetallic phases, while those prepared under a galvanic contact condition involved a Β-Sn phase containing a trace amount of copper. The formation of each Cu-Sn phase is discussed in terms of alloy formation thermodynamics.
Concurrence of de-alloying and re-alloying in a ternary Al67Cu18Sn15 alloy and the fabrication of 3D nanoporous Cu-Sn composite structures
Song,Yan,Gao,Atrens,Qian
, p. 9574 - 9580 (2015)
We report the concurrence of de-alloying and re-alloying in a ternary Al67Cu18Sn15 alloy (at.%) de-alloyed in a 5 wt% hydrochloric acid (HCl) solution at 70 ± 2°C, and the fabrication of three-dimensional (3D) nanoporous Cu3Sn-Cu-Cu6Sn5 composites in the form of self-supporting foils. Re-alloying occurred in Al67Cu18Sn15 compared to de-alloying alone in binary Al-Cu alloys. Both Cu3Sn and Cu6Sn5 phases formed through an accompanied re-alloying process. This finding further proves the temperature sensitivity of phase formation in the Cu-Sn system established from Cu-Sn diffusion couple studies, and demonstrates the capability of designing and creating nanoporous composite materials via de-alloying a multicomponent alloy.
Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging
Zhang, Liang,Xue, Song Bai,Zeng, Guang,Gao, Li Li,Ye, Huan
, p. 38 - 45 (2012)
Trace amount of rare earth Ce (0.03 wt.%) was added into SnAgCu solder in order to reform the properties of the solder. In this study, interface reaction mechanism during thermal cycling and isothermal aging, was studied by studying the formation and growth of the intermetallic compound (IMC) at the solder (SnAgCu or SnAgCuCe)/Cu interface, and the growth kinetics which forming IMC in both systems (SnAgCu or SnAgCuCe) were also investigated under different aging conditions. The results show that the morphology of IMCs formed both at SnAgCu/Cu and SnAgCuCe/Cu interfaces was gradually changed from scallop-like to planar-like, and the thickness of different IMCs evolved with the increasing of aging time. The results also indicate that the growth rate of IMC at both interfaces during thermal cycling was higher than that during isothermal aging. Especially, the addition of amount of rare earth Ce into the SnAgCu solder can refine the microstructures; decrease the thickness of the intermetallic compound layer of SnAgCu solder alloys.
On the mechanism of the binary Cu/Sn solder reaction
Goerlich,Schmitz,Tu
, p. 1 - 3 (2005)
The solder reaction of Cu and molten pure Sn is studied by scanning and transmission electron microscopy. Similar as reported for SnPb solder, the intermetallic Cu6Sn5 product is formed in a scallop-like morphology and a growth kinetic proportional to the cube root of time is found. Size distributions and shape of the scallops are determined experimentally. Comparing the binary reaction couple Cu/Sn with the technical combination Cu/SnPb, a significant difference in the length to width aspect ratio of individual scallops is noticed. We demonstrate by transmission electron microscopy that neighbored scallops are not separated by channels of solder, but by grain boundaries. Thus, grain boundary transport is the rate controlling step and the observed variation in scallop shape is due to differences in the interface tensions of the two reaction couples.
