C O M M U N I C A T I O N S
the data to second-order catalyzed kinetics.16 Rate constants at 100
°C and kAUTO/kBASE ratios are shown in Table 1.
The film stability and kinetic data show that structural factors
such as cyclic vs acyclic bodies, hydroxyl vs acetate triggers, and
primary vs secondary sulfonic esters significantly influence the
reactivity of the AAs. Compounds 1a, 1b, 3b are useful AAs. They
are relatively stable in polymeric films, have slow decomposition
rates in the presence of base, yet have an excellent rate ratio between
catalyzed and uncatalyzed decomposition. Preliminary lithographic
evaluation shows that they can increase sensitivity (E0) by
12-40%.17 Compound 2 shows greatly reduced thermal stability,
which we ascribe to the secondary attachment of the sulfonic acid
to the acyclic chain.
Figure 3. Scanning electron micrographs of dense line images printed using
a control resist formulation with and without 70 mM 3b.12
Acknowledgment. This work was supported by Intel Corporation.
Figure 2 shows thermal decomposition kinetics for compounds
3a and 3b. Remarkably, although these compounds only differ by
the identity of the trigger group (OH or OAc, respectively), their
thermal decomposition kinetics differ significantly. AA 3a is
thermally unstable, decomposing in the resist film <70 °C, and
decomposing rapidly in solution independent of the presence of
added base. Clearly, this compound does not decompose by an acid-
catalyzed reaction mechanism. In contrast, AA 3b is quite stable,
as it passed the film stability test at 110 °C. Molecular modeling
of the uncatalyzed thermolysis reactions for 3a and 3b provides
some possible insight. The modeling predicts a transition state, 4
(Figure 1), where the proton on the hydroxyl moiety of AA 3a
protonates the sulfonyl oxygen during C-O bond breaking.
Supporting Information Available: Experimental procedures and
spectroscopic data for starting materials and products. This material is
References
(1) Ito, H.; Breyta, G.; Hofer, D.; Sooriyakumaran, R.; Petrillo, K.; Seeger, D.
J. Photopolym. Sci. Technol. 1994, 7, 433–47.
(2) Shumway, M. D.; Naulleau, P.; Goldberg, K. A.; Bokor, J. J. Vac. Sci.
Technol. B 2005, 23, 2844–2847.
(3) Gallatin, G. M.; Naulleau, P.; Niakoula, D.; Brainard, R. L.; Hassanein,
E.; Matyi, R.; Thackeray, J.; Spear, K.; Dean, K. Proc. SPIE 2008, 6921,
69211E/1–69211E/11.
(4) Brainard, R. L.; Trefonas, P.; Lammers, J. H.; Cutler, C. A.; Mackevich,
J. F.; Trefonas, A.; Robertson, S. A. Proc. SPIE 2004, 5374 (Pt. 1), 74–
85.
(5) Ichimura, K. Chem. Record 2002, 2, 46–55.
(6) Gerdts, C. J.; Sharoyan, D. E.; Ismagilov, R. F. J. Am. Chem. Soc. 2004,
126, 6327–31.
(7) Lee, S.; Arimitsu, K.; Park, S.-W.; Ichimura, K. J. Photopoly. Sci. and
Tech. 2000, 13, 215–216.
(8) Park, S.-W.; Arimitsu, K.; Ichimura, K. Macromol. Rapid Commun. 2000,
21, 1050–1053.
(9) Arimitsu, K.; Kudo, K.; Ichimura, K. J. Am. Chem. Soc. 1998, 120, 37–
45.
(10) Kudo, K.; Arimitsu, K.; Ohmori.Ito, H.; Ichimura, K. Chem. Mater. 1999,
11, 2119–2125.
(11) We selected p- and o-CF3(C6H4)SO3-acid precursors because they yield
AAs with good thermal stability and give simple 19F spectra.
(12) Arimitsu, K.; Kudo, K.; Ichimura, K. J. Am. Chem. Soc. 1998, 120, 37–
45.
(13) Photoresist films were prepared containing 70 mM of an AA, 7.5% of the
photoacid generator bis(4-tert-butylphenyl)iodonium nonaflate and phenolic
terpolymer [poly(hydroxystyrene)-(styrene)(tert-buylacrylate) 65/20/15 mol
%] and 0.5 wt % of tetrabutyl ammonium hydroxide in 125 nm film on a
Si wafer. The film was then baked at 110 or 70 °C for 150 s and developed
in 0.26 N Me4N+ OH- for 45 s.
(14) Reaction rates (with and without 1.2 equiv of 2,4,6-tri-tert-butylpyridine)
were followed by integration of the CF3 peaks for the starting AA and the
product CF3C6H4SO3H (or its pyridine salt). Estimated error for rate
constants with and without base is 2.5% and 5%, respectively.
(15) Compound 1a was decomposed in the presence of 2,4,6-trimethylpyridine,
2,6-di-tert-butyl-4-methylpyridine, and 2,4,6-tri-tert-butylpyridine giving
Figure 2. Kinetic plots for the thermal decomposition of 3a and 3b in the
presence and absence of 2,4,6-tri-tert-butylpyridine.
first-order decomposition rate constants of k ) 9.7 × 10-5, 1.0 × 10-4
,
and 1.0 × 10-4 s-1, respectively. This result is consistent with the
interpretation that the base removes the acid from the reaction mechanism,
but the base does not actively participate in the reaction by extracting
protons from the AA bodies.
To assess the impact of our AAs on improving EUV patterning
performance, we calculated the Z-parameter18 of the control resist
along with resists prepared using 70 mM AAs 1a and 3b to be 74,
54, and 25 mJ*nm3, respectively (smaller is desired). These results
demonstrate simultaneous improvements in resolution, LER, and
sensitivity for 1a and 3b and as illustrated in the SEM images shown
in Figure 3 for 3b.19
1,3-Acyclic and 1,2-cyclic AAs expand the scope of available
methods for introducing strong fluorine-containing sulfonic acids
in chemically amplified photoresists enabling us to achieve
simultaneous improvements in resolution, LER, and sensitivity and
realize a 3-fold gain in the Z-parameter. These studies demonstrate
that small structural changes dramatically affect AA activity. Further
studies of this type will allow us to design even more effective
acid amplifiers.
(16) Second-order catalyzed reaction kinetics was evaluated by fitting data to:
Capellos, C.; Bielski, B. Kinetic Systems: Mathematical Description of
Chemical Kinetics in Solution; Wiley-Interscience: New York, 1972.
(17) E0’s were determined by exposing the resist film described in ref 15 to
stepwise doses of EUV light, baking at 110 or 70 °C for 90 s and then
developing for 45 s. The lowest dose to give zero thickness is E0.
(18) Z-parameters simultaneously evaluate the resolution, LER, and sensitivity
of a resist. Wallow, T.; Higgins, C.; Brainard, R.; Petrillo K.; Montgomery
W.; Koay C.-S.; Denbeaux G.; Wood O.; Wei Y. Proc. SPIE 2008,6921,
69211F/1-69211F/11.
(19) Four non-fluorinated AAs were evaluated in a 193 nm resist. Sensitivity
improved in all cases, and in one case resolution improved. (a) Naito, T.;
Ohfuji, T.; Endo, M.; Arimitsu, K.; Ichimura, K. J. Photopolym. Sci.
Technol. 1999, 12, 509–514. (b) Ohfui, T.; Takahashi, M.; Kuhara, K.;
Ogawa, T.; Ohtsuka, H.; Sasago, M.; Ichimura, K. Proc. SPIE 1997, 3049,
76–82.
JA901448D
9
J. AM. CHEM. SOC. VOL. 131, NO. 29, 2009 9863