JOURNAL OF POLYMER SCIENCE: PART A: POLYMER CHEMISTRY DOI 10.1002/POLA
3 Velez-Herrera, P.; Ishida, H. J Polym Sci Part A: Polym Chem
electron density of the electron density of nitrogen. For the
2009, 47, 5871–5881.
(4–6)/CNE thermosets, the 5% degradation temperatures
are 378, 385, and 406 C, respectively. The order is the same
ꢀ
4 Kiskan, B.; Aydogan, B.; Yagci, Y. J Polym Sci Part A: Polym
as that in P(4-6). Detailed investigation of the decomposition
mechanism by TGA-Mass is under investigation to confirm
the observation. As listed in Table 1, the 5% decomposition
temperature and char yield at 800 ꢀC of the (6)/CNE ther-
moset are 406 ꢀC and 40%, respectively, which are higher
than those of the (3)/CNE thermoset (385 ꢀC and 16%).
These results demonstrate the (4–6)/CNE thermosets have
better thermal stability than the (1–3)/CNE thermosets.
Chem 2009, 47, 804–811.
5 Sponto´ n, M.; Larrechi, M. S.; Ronda, J. C.; Galia`, M.; Ca´diz,
V. J Polym Sci Part A: Polym Chem 2008, 46, 7162–7172.
6 Kiskan, B.; Demirel, A. L.; Kamer, O.; Yagci, Y. J Polym Sci
Part A: Polym Chem 2008, 46, 6780–6788.
7 Chou, C. I.; Liu, Y. L. J Polym Sci Part A: Polym Chem 2008,
46, 6509–6571.
8 Andreu, R.; Reina, J. A.; Ronda, J. C. J Polym Sci Part A:
CONCLUSIONS
Polym Chem 2008, 46, 6091–6101.
Three aromatic diamine-based benzoxazines (4–6) were suc-
cessfully prepared by a one-pot procedure. Because of the
competition between the imine formation and the carbonyl
reduction, the reactivity of diamine is critical to the purity of
resultant benzoxazine. Benzoxazines based on diamines with
high reactivity (1–3) can be successfully prepared by this
one-pot procedure. In contrast, benzoxazine prepared by dia-
mine with low reactivity such as 4,40-diaminodiphyl sulfone
lead to poor purity.42 The clean and inexpensive hydrogen
reduction makes this one-pot attractive for industrial appli-
cations. Compared with diamines (1–3), diamine-based ben-
zoxazines (4–6) show some advantages as epoxy hardeners.
For example, the gel time of the (1)/CNE system is too short
to prepare a void-free sample for DMA measurement. In con-
trast, the gel time of the (4)/CNE system is long enough to
process a void-free sample. In addition to allowing for better
processing, the longer gel time makes the (4)/CNE system
attractive for IC encapsulation, in which low viscosity during
mold transfer is important. In addition to latent curing char-
acteristic, one particular benefit of using benzoxazine as an
epoxy hardener is its miscibility with epoxy resin. For exam-
ple, (2) and CNE are immiscible in the molten state, whereas
(5)/CNE is miscible and a single Tg in the DMA measure-
ment was observed for the (5)/CNE thermoset. Tgs of the
9 Andreu, R.; Reina, J. A.; Ronda, J. C. J Polym Sci Part A:
Polym Chem 2008, 46, 3353–3366.
10 Agig, T.; Takeichi, T. Macromolecules 2001, 34, 7257–7263.
11 Agig, T.; Takeichi, T. Macromolecules 2003, 36, 6010–6017.
12 Brunovska, Z.; Lyon, R.; Ishida, H. Thermochimica Acta
2000, 357, 195–203.
13 Brunovska, Z.; Ishida, H.
J Appl Polym Sci 1999, 73,
2937–2949.
14 Ishida, H.; Ohba, S. Polymer 2005, 46, 5588–5595.
15 Choi, S. W.; Ohba, S.; Brunovska, Z.; Hemvichian, K.; Ishida,
H. Polym Degrad Stab 2006, 91, 1166–1178.
16 Kimura, H.; Murata, Y.; Matsumoto, A.; Hasegawa, K.; Oht-
suka, K.; Fukuda, A. J Appl Polym Sci 1999, 74, 2266–2273.
17 Su, Y. C.; Chang, F. C. Polymer 2003, 44, 7989–7996.
18 Takeichi, T.; Kano, T.; Agag, T. Polymer 2005, 46,
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19 Ergin, M.; Kiskan, B.; Gacal, B.; Yagci, Y. Macromolecules
2007, 40, 4724–4727.
20 Kiskan, B.; Demiray, G.; Yagci, Y. J Polym Sci Part A: Polym
Chem 2008, 46, 3512–3518.
21 Kiskan, B.; Yagci, Y.; Ishida, H. J Polym Sci Part A: Polym
ꢀ
(4–6)/CNE thermosets are as high as 243–244 C, which are
Chem 2008, 46, 414–420.
23–48 ꢀC higher than those of P(4–6). According to the
height of tan d in the DMA measurement, the (4–6)/CNE
thermosets have higher crosslinking density than P(4–6),
explaining the high Tg characteristic of (4–6) as CNE harden-
ers. The combination of long pot-life, wide processing win-
dow, miscibility with epoxy, high Tg, and high dimensional
stability after curing makes the (4–6)/CNE systems potential
materials for IC encapsulation.
22 Chernykh, A.; Agag, T.; Ishida, H. Polymer 2009, 50,
382–390.
23 Allen, D. J.; Ishida, H. Polymer 2009, 50, 613–626.
24 Nagai, A.; Kamei, Y.; Wang, X. S.; Omura, M.; Sudo, A.;
Nishida, H.; Kawamoto, E.; Endo, T. J Polym Sci Part A: Polym
Chem 2008, 46, 2316–2325.
25 Endo, T.; Sudo, A. J Polym Sci Part A: Polym Chem 2009,
The authors would like to thank the National Science Council of
the Republic of China, Taiwan, for financial support. Partial
sponsorship by the Green Chemistry Project (NCHU), funded by
the Ministry of Education, is also gratefully acknowledged.
47, 4847–4858.
26 Brunovska, Z.; Liu, J. P.; Ishida, H. Macromol Chem Phys
1999, 200, 1745–1752.
27 Shen, S. B.; Ishida, H.
J Appl Polym Sci 1996, 61,
1595–1605.
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