Technology Process of 2-tert-butoxycarbonylamino-6-[5-(2-oxo-hexahydro-thieno[3,4-d]imidazol-6-yl)-pentanoylamino]-hexanoic acid 4-[9-(tert-butyl-diphenyl-silanyloxy)-3,7-dimethyl-nona-1,3,5,7-tetraenyl]-3,5,5-trimethyl-cyclohex-3-enyl ester
There total 10 articles about 2-tert-butoxycarbonylamino-6-[5-(2-oxo-hexahydro-thieno[3,4-d]imidazol-6-yl)-pentanoylamino]-hexanoic acid 4-[9-(tert-butyl-diphenyl-silanyloxy)-3,7-dimethyl-nona-1,3,5,7-tetraenyl]-3,5,5-trimethyl-cyclohex-3-enyl ester which
guide to synthetic route it.
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synthetic route:
- Guidance literature:
-
With
dmap; N-(3-dimethylaminopropyl)-N-ethylcarbodiimide;
In
dichloromethane; dimethyl sulfoxide;
for 20h;
DOI:10.1016/S0040-4020(02)00667-1
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20548-02-1,55058-51-0,60686-81-9,60686-82-0,82977-53-5,90082-06-7,90129-05-8,99881-84-2,60046-50-6
(4R,6R)-4-hydroxy-2,2,6-trimethylcyclohexan-1-one
- Guidance literature:
-
Multi-step reaction with 8 steps
1.1: 97 percent / DMAP; triethylamine / CH2Cl2
2.1: 68 percent / LDA
3.1: 67 percent / PdCl2(PPh3)2 / dimethylformamide / 30 h / 80 °C
4.1: n-BuLi / tetrahydrofuran / 0 - 20 °C
4.2: 99 percent / tetrahydrofuran / 2 h / 20 °C
5.1: 99 percent / TBAF / tetrahydrofuran / 0 - 20 °C
6.1: 432 mg / i-PrNH2; CuI / tetrakis(triphenylphosphine)palladium / 2 h / 20 °C
7.1: 99 percent / Zn; Cu(OAc)2; AgNO3 / H2O; methanol / 24 h / 20 °C
8.1: 78 percent / EDC; DMAP / CH2Cl2; dimethylsulfoxide / 20 h
With
dmap; copper(l) iodide; n-butyllithium; copper diacetate; tetrabutyl ammonium fluoride; silver nitrate; N-(3-dimethylaminopropyl)-N-ethylcarbodiimide; isopropylamine; triethylamine; zinc; lithium diisopropyl amide;
bis-triphenylphosphine-palladium(II) chloride; tetrakis(triphenylphosphine) palladium(0);
In
tetrahydrofuran; methanol; dichloromethane; water; dimethyl sulfoxide; N,N-dimethyl-formamide;
3.1: Heck reaction / 4.2: Horner-Wadsworth-Emmons reaction / 6.1: Sonogashira coupling;
DOI:10.1016/S0040-4020(02)00667-1
- Guidance literature:
-
Multi-step reaction with 9 steps
1.1: 66 percent / Raney Nickel
2.1: 97 percent / DMAP; triethylamine / CH2Cl2
3.1: 68 percent / LDA
4.1: 67 percent / PdCl2(PPh3)2 / dimethylformamide / 30 h / 80 °C
5.1: n-BuLi / tetrahydrofuran / 0 - 20 °C
5.2: 99 percent / tetrahydrofuran / 2 h / 20 °C
6.1: 99 percent / TBAF / tetrahydrofuran / 0 - 20 °C
7.1: 432 mg / i-PrNH2; CuI / tetrakis(triphenylphosphine)palladium / 2 h / 20 °C
8.1: 99 percent / Zn; Cu(OAc)2; AgNO3 / H2O; methanol / 24 h / 20 °C
9.1: 78 percent / EDC; DMAP / CH2Cl2; dimethylsulfoxide / 20 h
With
dmap; copper(l) iodide; n-butyllithium; copper diacetate; tetrabutyl ammonium fluoride; nickel; silver nitrate; N-(3-dimethylaminopropyl)-N-ethylcarbodiimide; isopropylamine; triethylamine; zinc; lithium diisopropyl amide;
bis-triphenylphosphine-palladium(II) chloride; tetrakis(triphenylphosphine) palladium(0);
In
tetrahydrofuran; methanol; dichloromethane; water; dimethyl sulfoxide; N,N-dimethyl-formamide;
4.1: Heck reaction / 5.2: Horner-Wadsworth-Emmons reaction / 7.1: Sonogashira coupling;
DOI:10.1016/S0040-4020(02)00667-1