Multi-step reaction with 22 steps
1: Et3N / CH2Cl2 / 0 °C
2: LiAlH4 / diethyl ether / Ambient temperature
3: H2 / PtO2 / ethyl acetate / 760 Torr / Ambient temperature
4: H2 / Pd(OH)2 / ethanol / 760 Torr / Ambient temperature
5: pyridine / Ambient temperature
6: n-Bu4NF / dimethylformamide / 50 °C
7: Swern oxidation
8: 2.) Et3N, DMAP / 1.) Et2O, -78 deg C, 2.) CH2Cl2
9: 90 percent / 48percent aq. HF / tetrahydrofuran / 0 deg C then room temp.
10: 1.) ICl, 2.) n-Bu4NF, HF / 1.) CH2Cl2, -78 deg C then 0 deg C, 2.) THF, 0 deg C, 1 min
11: p-TsOH / CH2Cl2; methanol / Ambient temperature
12: Swern oxidation
13: 73 percent / CrCl2, NiCl2 / dimethylsulfoxide; various solvent(s) / 2 h / Ambient temperature
14: t-BuOOH, VO(acac)2 / benzene / Ambient temperature
15: pyridine, DMAP / CH2Cl2 / Ambient temperature
16: n-Bu3SnH, AIBN / benzene / 0.05 h / Heating
17: imidazole / dimethylformamide / Ambient temperature
18: diethyl ether / 0 deg C then room temp.
19: Swern oxidation
20: tetrahydrofuran / -78 deg C then 0 deg C
21: n-Bu4NF / tetrahydrofuran / 2 h / Ambient temperature
22: Swern oxidation
With
pyridine; 1H-imidazole; chromium dichloride; tert.-butylhydroperoxide; dmap; lithium aluminium tetrahydride; bis(acetylacetonate)oxovanadium; 2,2'-azobis(isobutyronitrile); hydrogen fluoride; tetrabutyl ammonium fluoride; hydrogen; tri-n-butyl-tin hydride; Iodine monochloride; toluene-4-sulfonic acid; triethylamine; nickel dichloride;
platinum(IV) oxide; palladium dihydroxide;
In
tetrahydrofuran; methanol; diethyl ether; ethanol; dichloromethane; dimethyl sulfoxide; ethyl acetate; N,N-dimethyl-formamide; benzene;
DOI:10.1021/ja00189a069