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CAS No.: | 201058-08-4 |
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Name: | WANG RESIN |
Molecular Structure: | |
Formula: | C15H16O2 |
Molecular Weight: | 228.2863 |
Synonyms: | ALKO RESIN;4-HYDROXYMETHYLPHENOXYACETYL-4-METHYLBENZYHYDRYLAMINE RESIN;4-HYDROXYMETHYL-PHENOXY CHEMMATRIX RESIN;4-HYDROXYMETHYLPHENOXYMETHYL POLYSTYRENE;[4-(HYDROXYMETHYL)PHENOXYMETHYL]POLYSTYRENE DIVINYLBENZENE COPOLYMER;4-(HYDROXYMETHYL)PHENOXYMETHYL POLYSTYRENE RESIN;4-HYDROXYMETHYLPHENOXY RESIN;4-HYDROMETHYLPHENOXYACETIC ACID AM RESIN |
EINECS: | -0 |
Density: | 1.117 g/cm3 |
Boiling Point: | 386.2oC at 760 mmHg |
Flash Point: | 175.2oC |
Appearance: | off-white to beige beads |
Hazard Symbols: | Xn |
Risk Codes: | 20 |
Safety: | 22-36 |
PSA: | 29.46000 |
LogP: | 3.06630 |