1001-46-3 Usage
Uses
Used in Industrial Applications:
Di-n-Hexyl(methyl)silane is used as a hydrophobic coating agent for its ability to repel water and provide a protective layer on surfaces, enhancing durability and resistance to environmental factors.
Used as a Lubricant:
In the lubrication industry, Di-n-Hexyl(methyl)silane is employed as a lubricant due to its slippery nature, which reduces friction between moving parts and extends the lifespan of machinery.
Used in Silicone Production:
Di-n-Hexyl(methyl)silane is used as a cross-linking agent in the production of silicone rubbers and resins, contributing to the formation of stable and versatile silicone materials with a wide range of applications.
Safety Precautions:
Given its flammable nature, Di-n-Hexyl(methyl)silane should be handled with care in a well-ventilated area to prevent the risk of fire or explosion. Moreover, it is essential to follow proper safety measures when handling this substance, as it may be harmful if swallowed, inhaled, or absorbed through the skin.
Check Digit Verification of cas no
The CAS Registry Mumber 1001-46-3 includes 7 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 4 digits, 1,0,0 and 1 respectively; the second part has 2 digits, 4 and 6 respectively.
Calculate Digit Verification of CAS Registry Number 1001-46:
(6*1)+(5*0)+(4*0)+(3*1)+(2*4)+(1*6)=23
23 % 10 = 3
So 1001-46-3 is a valid CAS Registry Number.
InChI:InChI=1/C13H30Si/c1-3-5-7-9-11-13(14)12-10-8-6-4-2/h13H,3-12H2,1-2,14H3
1001-46-3Relevant academic research and scientific papers
Kreyes, Andreas,Mourran, Ahmed,Hong, Zhihua,Wang, Jingbo,Moeller, Martin,Gholamrezaie, Fatemeh,Roelofs, W. S. Christian,De Leeuw, Dago M.,Ziener, Ulrich
, p. 2128 - 2136 (2013)
The branching topology of end groups attached to several series of oligothiophenes has a systematic effect on thermal and electrical properties of the oligomers. The series were synthesized in a modular approach and show a distinct drop of the melting point Tm on increasing bulkiness of the substituents. The same trend can be found for the dissociation temperatures Tdis of aggregates in solution. Similarly, monolayer OFET mobilities μFET are significantly decreasing with increasing bulkiness of the substituents. A simple geometric model is presented quantitatively correlating the transition temperatures and mobilities with the substituents' structure based on a bulkiness parameter P, which allows predicting Tm, T dis, and μFET of corresponding not yet synthesized oligomers with branched substituents. This model might be generally applicable for end-capped rod-like conjugated oligomers.
