109348-07-4Relevant academic research and scientific papers
Selective O-allylation of bisphenol A: Toward a chloride-free route for epoxy resins
Van Rijn, Jimmy A.,Guijt, Marieke C.,Bouwman, Elisabeth,Drent, Eite
, p. 207 - 211 (2011)
The O-allylation of bisphenol A (BPA) has been performed with the most selective catalysts for O-allylation of phenols reported previously. Both the cyclopentadienyl-ruthenium catalysts and the palladium-diphosphine catalysts are capable of selectively performing single and double O-allylation of BPA. An intriguing solvent effect is observed; the choice of the solvent is of key importance for both conversion and selectivity. The use of an excess of diallyl ether as allylating agent results in relatively high yields of the bisallyl ether of bisphenol A, while maintaining the high selectivity for O-allylation.
COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP
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Page/Page column, (2015/06/03)
There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.
EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING THE SAME, COMPOSITION AND CURED PRODUCT COMPRISING THE SAME, AND USES THEREOF
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Paragraph 0409; 0410, (2014/07/08)
Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less The cured product of the composition exhibits good flame retardant properties.
EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION AND CURED MATERIAL COMPRISING SAME, AND USAGE THEREOF
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Paragraph 0337, (2014/09/02)
Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, a cured product of the composition and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, a glycidylation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, a cured product of the composition and a use of the composition are provided. The composite of the composition comprising the alkoxysilylated epoxy compound exhibits improved chemical bonding,-good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less via the enhanced chemical bonding efficiency of alkoxysilyl group. The cured product of the composition exhibits good flame retardant properties.
2,2-BIS(3-ALLYL-4-HYDROXYPHENYL)PROPANE
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Page/Page column 8-9; 1/1, (2008/06/13)
A high-purity 2,2-diallylbisphenol A which is easy to handle and is solid. It is for use as raw materials for electronic materials, such as a hardener for semiconductor encapsulation materials and an additive for polyimide resins. It is a 2,2-bis(3-allyl-4-hydroxyphenyl)propane which is solid at 30°C and represented by the formula (1). [Chemical formula 1] (1) The solid 2,2-diallylbisphenol A is obtained by subjecting liquid 2,2-diallylbisphenol A obtained through Claisen rearrangement to purification by an alkali treatment to obtain liquid 2,2-diallylbisphenol A having a purity of about 95 wt.% or higher and adding seed crystals to the purified compound to crystallize it.
METHOD FOR PURIFYING DIALLYLBISPHENOL COMPOUND
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Page/Page column 8-9, (2008/06/13)
Disclosed is a method for purifying a diallylbisphenol compound wherein a diallylbisphenol compound represented by the following general formula (1): (wherein R represents a hydrogen atom or a methyl group) is dissolved in a nonaqueous organic solvent and then cleaned with an aqueous alkali-containing solution at least once or more times. Also disclosed is a method for purifying a diallylbisphenol compound wherein an aqueous alkaline solution is added to a solution wherein the above diallylbisphenol compound is dissolved in a nonaqueous organic solution, and the thus-obtained aqueous alkali-containing solution of diallylbisphenol compound is neutralized after being cleaned with a nonaqueous organic solvent at least once or more times, and then extracted with a solvent which is distilled away after the extraction. With this method, 2,2-diallylbisphenol A or 2,2-diallylbisphenol C, which is useful as a curing agent for semiconductor sealing materials or an additive for polyimide resins, can be easily obtained with high purity.
