144080-77-3Relevant academic research and scientific papers
RESIN COMPOSITION
-
Paragraph 0184; 0185; 0189, (2019/08/18)
The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a p
(Meth) acrylamide derivative, polymer, chemically amplified photosensitive resin composition, and patterning method
-
Page/Page column 17, (2009/04/24)
The present invention relates to a novel (meth)acrylamide compound represented by the general formula (1), a (co)polymer of the (meth)acrylamide compound, and a chemically amplified photosensitive resin composition composed of the polymer and a photoacid generator. In the formula, R1 represents a hydrogen atom or a methyl group; R2 represents an acid-decomposable group; and R3 to R6 independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms.
