20445-88-9

Usage

Uses

Since there is no available information on HISHICOLIN PX-4MP, it is not possible to list its uses or applications in different industries. Additional context and information are needed to determine its potential applications and benefits.

Upstream product

• 813-78-5 dimethylphosphoric acid 
• 2304-24-7 methyltributylphosphonium chloride 
• 512-56-1 trimethyl phosphite 
• 998-40-3 tributylphosphine 

Relevant academic research and scientific papers

Physicochemical properties of tri-n-butylalkylphosphonium cation-based room-temperature ionic liquids

The physicochemical properties of novel four tri-n-butylalkylphosphonium- based room-temperature ionic liquids (RTILs), tri-n-butylmethylphosphonium dimethylphosphate ([P4,4,4,1][DMP]), tri-n-butyl(2-hydroxymethyl) phosphonium bis(trifluoromethylsulfonyl)amide ([P4,4,4,2OH][Tf 2N]), tetra-n-butylphosphonium O,Oa?2-diethylphosphorodithioate ([P4,4,4,4][DEPDT]), and tri-n-butyldodecylphosphonium 3,5-bis(methoxycarbonyl)benzenesulfonate ([P4,4,4,12][MCBS]), were examined in this study. All RTILs showed a favorable thermal decomposition temperature exceeding 560 K. Of these, [P4,4,4,12][MCBS] exhibited a fairly high thermal stability compared with common phosphonium cation-based RTILs reported to date. Interestingly [P4,4,4,1][DMP] formed an ionic plastic crystal phase within a range of 279-290 K, but that was not the case with [P4,4,4,4][DEPDT], which is similar in the cation and anion structures to the [P4,4,4,1]+ and [DMP]-. [P4,4,4,2OH][Tf2N] showed a relatively high conductivity of 0.48 mS cm-1 at 303 K among the RTILs consisting of tri-n-butylalkylphosphonium cation and usual fluoroanion. ? 2013 American Chemical Society.

CURING ACCELERATOR FOR DEEP-ULTRAVIOLET-TRANSMITTING EPOXY RESIN, DEEP-ULTRAVIOLET-TRANSMITTING EPOXY RESIN COMPOSITION, AND DEEP-ULTRAVIOLET-TRANSMITTING EPOXY RESIN CURED PRODUCT

An object of the present invention is to provide a deep-ultraviolet-transmitting epoxy resin cured product having high heat resistance and high resistance to deep-ultraviolet light, and to provide a curing accelerator and an epoxy resin composition which are used for producing the epoxy resin cured product. The curing accelerator for deep-ultraviolet-transmitting epoxy resins comprises a tetraalkylphosphonium dialkyl phosphate represented by the following general formula (1): wherein R1, R2, R3, R4, R5, and R6 each represent an alkyl group or an alkyl group having a hydroxyl group, which has 1 to 8 carbon atoms and is linear, branched, or alicyclic; and R1, R2, R3, R4, R5, and R6 may be the same or different. Also disclosed are an epoxy resin composition comprising the curing accelerator and an epoxy resin cured product obtained by curing the resin composition.