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32287-65-3

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32287-65-3 Usage

Check Digit Verification of cas no

The CAS Registry Mumber 32287-65-3 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 3,2,2,8 and 7 respectively; the second part has 2 digits, 6 and 5 respectively.
Calculate Digit Verification of CAS Registry Number 32287-65:
(7*3)+(6*2)+(5*2)+(4*8)+(3*7)+(2*6)+(1*5)=113
113 % 10 = 3
So 32287-65-3 is a valid CAS Registry Number.

32287-65-3 Well-known Company Product Price

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  • (Code)Product description
  • CAS number
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  • Detail
  • Alfa Aesar

  • (10623)  Aluminum fluoride hydrate, Puratronic?, 99.99% (metals basis)   

  • 32287-65-3

  • 5g

  • 355.0CNY

  • Detail
  • Alfa Aesar

  • (10623)  Aluminum fluoride hydrate, Puratronic?, 99.99% (metals basis)   

  • 32287-65-3

  • 25g

  • 1826.0CNY

  • Detail
  • Alfa Aesar

  • (10623)  Aluminum fluoride hydrate, Puratronic?, 99.99% (metals basis)   

  • 32287-65-3

  • 100g

  • 5747.0CNY

  • Detail

32287-65-3SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 16, 2017

Revision Date: Aug 16, 2017

1.Identification

1.1 GHS Product identifier

Product name trifluoroalumane,hydrate

1.2 Other means of identification

Product number -
Other names Aluminum fluoride hydrate

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:32287-65-3 SDS

32287-65-3Downstream Products

32287-65-3Relevant articles and documents

Comparison of the thermal behaviour of α-AlF3 and aluminium fluoride hydrates

Menz,Zacharias,Kolditz

, p. 811 - 815 (1988)

The thermal decompositions of β-AlF3·3H2O, AlF3·3.5H2O, AlF3·1.5H2O, β-AlF3 and hydroxyfluorides of aluminium were investigated. The literature data were complemented with X-ray

Etching AlAs with HF for epitaxial lift-off applications

Voncken,Schermer,Van Niftrik,Bauhuis,Mulder,Larsen,Peters,De Bruin,Klaassen,Kelly

, p. G347-G352 (2008/10/09)

The epitaxial lift-off process allows the separation of a thin layer of III/V material from the substrate by selective etching of an intermediate AlAs layer with HF In a theory proposed for this process, it was assumed that for every mole of AIAs dissolved three moles of H2 gas are formed. In order to verify this assumption the reaction mechanism and stoichiometry were investigated in the present work. The solid, solution and gaseous reaction products of the etch process have been examined by a number of techniques, It was found that aluminum fluoride is formed, both in the solid form as well as in solution. Furthermore, instead of H2 arsine (AsH3) is formed in the etch process. Some oxygen-related arsenic compounds like AsO, AsOH, and AsO2 have also been detected with gas chromatography/mass spectroscopy. The presence of oxygen in the etching environment accelerates the etching process, while a total absence of oxygen resulted in the process coming to a premature halt. It is argued that, in the absence of oxygen, the etching surface is stabilized, possibly by the sparingly soluble A1F3 or by solid arsenic.

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