Detail of > 2386-87-0
- CAS Number:
- 2386-87-0
- Name:
3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate
- Formula:
- C14H20O4
- Molecular Structure:

- Synonyms:
- 3,4-Epoxycyclohexanecarboxylic acid(3,4-epoxycyclohexylmethyl) ester;3,4-Epoxycyclohexanemethyl3,4-epoxycyclohexanecarboxylate;3,4-Epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate;7-Oxabicyclo[4.1.0]heptan-4-ylmethyl7-oxabicyclo[4.1.0]heptane-4-carboxylate;UP-632 monomer;
- Molecular Weight:
- 252.31
- EINECS:
- 219-207-4
- Density:
- 1.223 g/cm3
- Melting Point:
- -37 °C(lit.)
- Boiling Point:
- 363.4 °C at 760 mmHg
- Flash Point:
- 160.5 °C
- Hazard Symbols:
Xi- Risk Codes:
- 43
- Safety:
- 36/37Details
- Deleted CAS:
- 37042-87-8
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Reference
- Ultraviolet-curable compositions
- Ultraviolet-curable compositions. (Mitsui Toatsu Chemicals, Inc., Japan). Jpn. Kokai Tokkyo Koho JP 59199714 A2 12 Nov 1984 Showa, 6 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08G059-68. APPLICATION: JP 83-73979 28 Apr 1983. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 74 The title compns. of low viscosity, forming cured products with excellent flexibility, heat resistance, chem. resistance, and adhesion to substrates contain a compd. having 31 oxirane ring, 0.05-0.8 equiv. (per oxirane ring) lactone, and a triarylsulfonium salt. Thus, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate [2386-87-0] 70, e-caprolactone (I) [502-44-3] 30, triphenylsulfonium hexafluoroarsenate [57900-42-2] 2, talc 25, fine powd. silica 2, and phthalocyanine green 0.2 part were mixed to obtain a solder resist. The resist was coated 15-m thick on a Cu-foil-plated polyimide film and UV-irradiated for 10 s to form a cured film with good adhesion, while a poor adhesion was obsd. without I. 2386-87-0 is just another one chemical used in this study. 2386-87-0 are also occured in this study. ..
- Ultraviolet-curable compositions
- Ultraviolet-curable compositions. (Mitsui Toatsu Chemicals, Inc., Japan). Jpn. Kokai Tokkyo Koho JP 59199714 A2 12 Nov 1984 Showa, 6 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08G059-68. APPLICATION: JP 83-73979 28 Apr 1983. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 74 The title compns. of low viscosity, forming cured products with excellent flexibility, heat resistance, chem. resistance, and adhesion to substrates contain a compd. having 31 oxirane ring, 0.05-0.8 equiv. (per oxirane ring) lactone, and a triarylsulfonium salt. Thus, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate [2386-87-0] 70, e-caprolactone (I) [502-44-3] 30, triphenylsulfonium hexafluoroarsenate [57900-42-2] 2, talc 25, fine powd. silica 2, and phthalocyanine green 0.2 part were mixed to obtain a solder resist. The resist was coated 15-m thick on a Cu-foil-plated polyimide film and UV-irradiated for 10 s to form a cured film with good adhesion, while a poor adhesion was obsd. without I. 2386-87-0 is just another one chemical used in this study. 2386-87-0 are also occured in this study. ..
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