Detail of "3878-45-3"

CAS Number:
3878-45-3
Name:
Phosphine sulfide,triphenyl-
Molecular Structure:
Formula:
C18H15 P S
Molecular Weight:
294.36
Synonyms:
NSC 62216;Triphenylphosphine monosulfide; Triphenylphosphine sulfide
EINECS:
223-407-7
Density:
1.2 g/cm³
Melting Point:
161-163 °C(lit.)
Boiling Point:
428.7 °C at 760 mmHg
Flash Point:
213.1 °C
Appearance:
WHITE CRYSTALLINE SOLID
Hazard Symbols:
A poison.
Risk Codes:
21/22-36/37/38
Safety:
A poison by intravenous route. When heated to decomposition it emits toxic vapors of PO_x and SO_x. Details

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Elemental analysis of organic phosphorus compounds: Elemental analysis of organic phosphorus compounds. X.Several substances are used for example 3878-45-3 and 940-71-6 which are their cas registry numbers. Schoeniger-flask method for phosphorus. Binkowski, J.; Rutkowski, P. (Cent. Mol. Macromol. Stud., Pol. Acad. Sci., Lodz PL-90-362, Pol.). Mikrochim. Acta, Volume Date 1986, 1(3-4), 245-7 (English) 1987. CODEN: MIACAQ. ISSN: 0026-3672. DOCUMENT TYPE: Journal CA Section: 80 (Organic Analytical Chemistry) By use of a fused-silica hook for holding the sample packet in a Schoeniger combustion flask, even difficultly combustible P compds. can be completely decompd. .

Potting compounds for semiconductor devices: Potting compounds for semiconductor devices. (Toshiba Corp., Japan). Jpn. Kokai Tokkyo Koho JP 58119656 A2 16 Jul 1983 Showa, 5 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: H01L023-30; C08G059-62; C08G059-68. APPLICATION: JP 82-861 8 Jan 1982.Several reagents with their cas registry numbers 3878-44-2 and 3878-45-3 are used here. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 76 Potting compds. having high reliability contain a novolak epoxy resin (epoxy equiv. 170-300), a phenolic novolak (softening temp. 60-120°), and RR1R2M:X (M = P, As, Sb, Bi; X = O, S, Se; R = org. group; R1, R2 = H, org. group). Thus, a cresol novolak-based epoxy resin (epoxy equiv. 220) 180, a brominated epoxy novolak (epoxy equiv. 290) 20, a phenolic novolak (softening temp. 80°) 91, Ph3PS [3878-45-3] 8, powd. quartz glass 700, Sb2O3 30, carbon black 3, carnauba wax 4, and a silane coupler 4 parts were hot-roll blended, transfer molded onto a semiconductor device at 195° for 10 min, and cured at 180° for 10 h to give a specimen showing good reliability in a pressure-cooker test (120°, 2 atm steam, 160 h) and a leakage-current test at 100° for 500 min. .