883502-14-5Relevant articles and documents
Evolution of N-Heterocycle-Substituted Iodoarenes (NHIAs) to Efficient Organocatalysts in Iodine(I/III)-Mediated Oxidative Transformations
Boelke, Andreas,Nachtsheim, Boris J.
supporting information, p. 184 - 191 (2019/12/11)
The reactivity of ortho-functionalized N-heterocycle-substituted iodoarenes (NHIAs) as organocatalysts in iodine(I/III)-mediated oxidations was systematically investigated in the α-tosyloxylation of ketones as the model reaction. During a systematic catalyst evolution, it was found that NH-triazoles and benzoxazoles have the most significant positive influence on the reactivity of the central iodine atom. A further catalyst improvement which focused on the substitution pattern of the arene revealed a remarkable ortho-effect. By introduction of an o-OMe group we were able to generate a novel NHIA with a so far unseen catalytic efficiency. This new catalyst is not only easy to synthesize but also enabled the α-tosyloxylation of carbonyl compounds at the lowest reported catalyst loading of only 1 mol%. Finally, the performance of this iodine(I) catalyst was successfully demonstrated in intramolecular oxidative couplings of biphenyls and oxidative rearrangements. (Figure presented.).
THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND
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, (2018/06/15)
The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.
Bisphenol-based epoxy compound using thiol-ene reaction and method for preparing the same, and composite of organic-inorganic materials comprising a cured product thereof and method for preparing the composite
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, (2017/08/24)
The present invention relates to a bisphenol-based epoxy compound having an alkoxysilylalkyl-S-alkyl group and a method for preparing the same, a composite of organic-inorganic materials comprising the cured product and a method for preparing the composite. The novel bisphenol-based epoxy compound can provide a composite which shows improved thermal resistance and thermal expansion properties and has excellent hardness when being used for manufacturing high-integration and high-performance electronic components such as a next-generation semiconductor substrate and PCB.COPYRIGHT KIPO 2017
METHOD OF CONSISTENTLY PRODUCING DIALLYLBISPHENOLS
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Paragraph 0104-0107, (2017/01/23)
The purpose of the present invention is to provide a method of consistently producing high-quality diallylbisphenols with high yields from bisphenols. This method involves steps (1) through (3) below, and enables the consistent production of diallylbisphenols from bisphenols. (1) A step for reacting allyl halides and bisphenols or alkali metal salts thereof in a cellosolve solvent in the presence or absence of basic alkali metal salts, (2) a step for separating inorganic salt by-products from a reaction solution obtained in step (1), and (3) a step for heating and subjecting to a rearrangement reaction the reaction solution obtained in step (2).
ALKOXYSILYL COMPOUND HAVING AT LEAST TWO ALKOXYSILYL GROUPS, COMPOSITION, CURED PRODUCT THEREOF, USE THEREOF AND PREPARING METHOD OF ALKOXYSILYL COMPOUND HAVING AT LEAST TWO ALKOXYSILYL GROUPS
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, (2016/12/07)
The present invention relates to an alkoxysilyl compound having two or more alkoxysilyl groups (hereinafter, referred to as ″alkoxysilyl compound″) showing an excellent heat-resistance in a composite, a composition and a cured product comprising the same, an use thereof, and a method for preparing the alkoxysilyl compound. The alkoxysilyl composition comprising the novel alkoxysilyl compound, according to the present invention, in a composite, shows improved heat-resistance, i.e., an effect of decreasing CTE of the alkoxysilyl composition, or an effect of increasing glass transition temperature or not showing glass transition temperature (hereinafter, referred to as ″Tg less″) by forming a chemical bond between the alkoxysilyl group and a filler (fibers and/or particles). Further, the cured product comprising the alkoxysilyl compound according to the present invention shows an excellent flame retardant property due to the alkoxysilyl group. Moreover, when the alkoxysilyl composition according to the present invention is applied to a metal film of a substrate, an excellent adhesion to the metal film is exhibited due to a chemical bond between a functional group on a surface of the metal film and the alkoxysilyl group.
COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP
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Page/Page column, (2015/06/03)
There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.
EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING THE SAME, COMPOSITION AND CURED PRODUCT COMPRISING THE SAME, AND USES THEREOF
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, (2014/07/08)
Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less The cured product of the composition exhibits good flame retardant properties.
Investigations of thiol-modified phenol derivatives for the use in thiol-ene photopolymerizations
Reinelt, Sebastian,Tabatabai, Monir,Fischer, Urs Karl,Moszner, Norbert,Utterodt, Andreas,Ritter, Helmut
, p. 1733 - 1740 (2014/08/18)
Thiol-ene photopolymerizations gain a growing interest in academic research. Coatings and dental restoratives are interesting applications for thiol-ene photopolymerizations due to their unique features. In most studies the relative flexible and hydrophilic ester derivative, namely pentaerythritoltetra(3-mercaptopropionate) (PETMP), is investigated as the thiol component. Thus, in the present study we are encouraged to investigate the performance of more hydrophobic ester-free thiol-modified bis-and trisphenol derivatives in thiol-ene photopolymerizations. For this, six different thiol-modified bis-and trisphenol derivatives exhibiting four to six thiol groups are synthesized via the radical addition of thioacetic acid to suitable allyl-modified precursors and subsequent hydrolysis. Compared to PETMP better flexural strength and modulus of elasticity are achievable in thiol-ene photopolymerizations employing 1,3,5-triallyl-1,3,5-triazine-2,4,6-trione (TATATO) as the ene derivative. Especially, after storage in water, the flexural strength and modulus of elasticity is twice as high compared to the PETMP reference system.
EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION AND CURED MATERIAL COMPRISING SAME, AND USAGE THEREOF
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, (2014/09/02)
Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, a cured product of the composition and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, a glycidylation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, a cured product of the composition and a use of the composition are provided. The composite of the composition comprising the alkoxysilylated epoxy compound exhibits improved chemical bonding,-good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less via the enhanced chemical bonding efficiency of alkoxysilyl group. The cured product of the composition exhibits good flame retardant properties.
Highly stable self-crosslinked anion conductive ionomers for fuel cell applications
Jasti, Amaranadh,Shahi, Vinod K.
, p. 19238 - 19241 (2014/05/20)
We report a simple method for the preparation of self-crosslinked anion conductive ionomers (SCL-ACIs) via polycondensation-Friedel-Crafts alkylation reactions without using any catalyst or crosslinking agent. The reported alkaline stable and methanol impervious SCL-ACIs with 2.45 mequiv. g -1 ion-exchange capacity (IEC) and 68 mS cm-1 hydroxide ion conductivity were assessed as suitable candidates for alkaline direct methanol fuel cell (ADMFC) applications. the Partner Organisations 2014.
