664
C.-W. Yeh et al. / Polyhedron 31 (2012) 657–664
shows the loss ofꢂthe bonded CH3CN molecule (Calc. 7.9%, obs.
7.7%) and the NO3 anions (Calc. 11.9%, obs. 12.0%) in the ranges
118–144 °C and 260–290 °C, respectively. The weight loss from
290 to 355 °C is consistent with the removal of the L3 ligands.
The residual product weights of 8.5%, 7.5%, 7.3%, 8.9% and 21.1%
for 1–5 were finally found above 360 °C, corresponding to the for-
mation of the metal oxides (CuO, calcd. 9.3% for 1; CoO Calc. 7.6%,
7.9% and 9.7% for 2–4 and Ag2O Calc. 22.3% for 5).
Centre, 12 Union Road, Cambridge CB2 1EZ, UK; fax: +44 1223
336 033; or e-mail: deposit@ccdc.cam.ac.uk. Supplementary data
associated with this article can be found, in the online version, at
References
The TGA results show that the solvent molecules were removed
at higher temperatures than their corresponding boiling points,
and this result indicates that the solvent molecules are stabilized
in the structures. In complex 5, the L3 ligands were removed at
temperatures above 290 °C, which are higher than those for the
L1 and L2 ligands in complexes 1–4. This result suggests that the
structure of the 1-D polymeric chain of 5 is more thermally stable
than those of the 0-D monomeric complexes, 1–4. Additionally, the
TGA results show that complexes 1–5, which contain the phosphi-
nic amide ligands, are thermally stable and the L1, L2 and L3 li-
gands decomposed at temperatures above 225 °C.
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Appendix A. Supplementary data
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CCDC 840540, 840541, 840542, 840543, 840544 contains the
supplementary crystallographic data for 1, 2, 3, 4, 5. These data