Journal of Materials Science: Materials in Electronics
Table 3 The physical parameters of Al, Si and Mg2Si [9, 31]
References
Al
Si
Mg2Si
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CTE (×10−6/°C)
Bulk modulus (K, GPa)
22.6
67.8
2.5
97.0
7.5
51.7
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where ꢀ1, ꢀ2, ꢀ3 andV1, V2, V3 represent the CTE and volume
fraction of each component, respectively. The Turner model
assumes that the interface between the reinforcement and the
substrate is well bonded and no internal stress exists in the
material. The Turner model is expressed as [30]:
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ꢀ1V1K1 + ꢀ2V2K2 + ꢀ3V3K3
ꢀ =
(17)
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V1K1 + V2K2 + V3K3
where K refers to bulk modulus and is listed in Table 3.
Nevertheless, neither of the models take the efect of distri-
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With a view to the microstructures shown in Fig. 1, a rea-
sonable interpretation can be used to account for this abnor-
mal phenomenon. The fne and regular primary Si crystals
distribute evenly in the P-modifed Al–50Si alloy, which
will increase the interfaces between the Si crystal and Al
matrix and also elevate the specifc surface areas of Si crys-
tal on the unit area so that the thermal expansion behavior is
suppressed. However, due to the irregular morphology and
heterogeneous distribution of Si crystal caused by the toxic
efect of Mg3P2, the Al matrix in Al–50Si–xMg (x=5,10)
alloys will generate a large area of connected mesh with each
other, which will immensely reduce the restraining action of
the Si phase on the Al matrix, resulting in the rising in CTE.
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4 Conclusions
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4. The P-modifed Al–50Si alloys with diferent Mg con-
tents cannot meet the requirements of CTE and strength
which are needed in the feld of electronic packaging.
1 3