
Journal of the American Chemical Society p. 997 - 1003 (1990)
Update date:2022-07-31
Topics:
Gronert, Scott
O'Hair, Richard A. J.
Prodnuk, Stephen
Sülzle, Detlev
Damrauer, Robert
DePuy, Charles H.
The silaformyl anion, HSiO-, has been prepared by collisionally induced dissociation (CID) of H3SiO in a tandem flowing afterglow selected ion flow tube (FA-SIFT). The chemistry of the silaformyl anion has been studied in detail. Reactions with CO2, COS, CS2, SO2, O2, acetic acid, nitromethane, and hexafluorobenzene reveal a rich chemistry. For example, the silaformyl anion reacts with CO2 by both an oxidative pathway giving HSiO2- and CO and a reductive path giving SiO and HCO2-. Typically, the silaformyl anion, which could have several sites of reactivity, behaves both as an oxygen nucleophile and as a hydride donor. Detailed mechanistic studies have been carried out on many of these reactions with isotopically labeled H29SiO- and HSi18O-. In addition to its reaction chemistry, the heat of formation of the silaformyl anion, its basicity, and the heat of formation of its parent compound have been estimated. Ab initio computations on the silaformyl anion have been carried out and demonstrate that HSiO- is more than 40 kcal/mol more stable than HOSi-.
Hangzhou Sartort Biopharma Co., Ltd
website:http://www.sartort.com
Contact:86-571-87039693
Address:No. 57, Tech Park Road, Hangzhou, Zhejiang, China
Contact:Tel:+86-29-88764861 Fax:+86-29-88764861
Address:Rm#2107, Block A, Epin Meidao Building, Gaoxin Rd, Hi-Tech Zone, Xi’an, China
Tianjin Dongchang Fine Chemical Industry Co., Ltd.
Contact:+86-22-29894595
Address:Economic Developing Zone, Ji County, Tianjin, China
Contact:+86-10-67147360/67107388
Address:No.18 Guangming Zhongjie, Chongwen District, Beijing, 100061, China
Anhui New Star Pharmaceutical Development Co., Ltd
Contact:013956922763
Address:Floor 3, F9A, F Workshop, No.110 Kexue Road, High-Tech Development Zone, Hefei, Anhui ,China
Doi:10.1016/j.tet.2004.07.003
(2004)Doi:10.1039/jr9430000635
(1943)Doi:10.1055/s-1975-23894
(1975)Doi:10.1021/ja00894a015
(1963)Doi:10.1271/bbb.67.1761
(2003)Doi:10.1016/j.tet.2003.11.020
(2004)