4670
Y. Didane et al. / Tetrahedron 68 (2012) 4664e4671
ðIDÞsat ¼ ðW=2LÞCi ðVG ꢀ VtÞ2
m
(1)
J¼3.75 Hz, Hthio), 7.05 (d, 2H, J¼3.75 Hz, Hthio), 7.21 (d, 2H,
J¼16.50 Hz, Heth), 7.65 (s, 2H, Hbenz), 7.80 (s, 4H, Hbenz). 1HMRS:
calcd 642.0345, found 642.0367. Elemental Anal. calcd for
C28H14F12S2: C, 52.34; H, 2.20; S, 9.98, F, 35.48. Found: C, 52.79; H,
2.00; S, 10.07.
where Ci is the capacitance per unit area of the gate insulator layer,
VG is the gate voltage, Vt is the threshold voltage, and is the field-
effect mobility. All the data were obtained by randomly measuring
m
five individual OTFTs for each substrate temperature.
4.1.6. Physicochemical measurements in solution. UVevisible ab-
sorption spectra were obtained on a Varian Cary 1E spectropho-
tometer. The electronic absorption maximum (lmax) and the optical
band gap (Eg) are directly extracted from absorption spectra of CF3-
DS2T and diCF3-DS2T based solution. Cyclic voltammetry (CV) data
were acquired using a BAS 100 Potentiostat (Bioanalytical Systems)
and a PC computer containing BAS100W software (v2.3). A three-
electrode system based on a platinum (Pt) working electrode (di-
ameter 1.6 mm), a Pt counter electrode and an Ag/AgCl (with 3 M
NaCl filling solution) reference electrode was used. Tetrabuty-
lammonium hexafluorophosphate (TBHP) (Fluka) was used as re-
ceived and served as supporting electrolyte (0.1 M). All experiments
were carried out in anhydrous 1,2-dichlorobenzene (electronic
grade purity) at 20 ꢁC. Ferrocene was used as internal standard.
Electrochemical reduction/oxidation potential versus Fc/Fcþ
(E1/2(red1) and E1/2(ox1)) values are determined from the cyclic
voltammogram at a concentration of 1ꢂ10ꢀ3 M with a scan rate of
4.1.8. Film characterizations. Atomic force microscopy (AFM) mea-
surements were done on thin films in air with a Nanoscope III
Multimode (Instrument, Inc.), operating in the tapping mode. Fur-
thermore, thin films were analyzed by X-ray film diffractometry
(XRD) where thin films of CF3-DS2T and diCF3-DS2T were fabri-
cated by vacuum deposition in a pressure of 5ꢂ10ꢀ5 Pa using K-cell
type crucible. Si wafer (covered by SiO2 layer 300 nm thick) was
used as substrates, which were kept at room temperature (Tsub¼RT)
or heated to 80 ꢁC (Tsub¼80 ꢁC). The deposition rate and final film
thickness were 1.2 nm/min and 50 nm, respectively. The as-
deposited thin films were characterized using X-ray diffraction in
air using an X-ray diffractometer (Regaku Co., ATX-G), which was
specially designed for characterization of thin films. The used
wavelength of X-ray in the experiments was 0.1542 nm.
4.1.9. Computational Methodology. DFT calculations were carried
out using the Gaussian 03 program.42 Becke’s three-parameter
exchange functional combined with the LYP correlation functional
(B3LYP) was employed.43 We also made use of the standard
6e31G** basis set.44
50 mV sꢀ1
.
4.1.7. OTFTs fabrication. The Bottom-Gate Top-Contact (BGTC)
configuration was used for the OTFT devices based on CF3-DS2T
and diCF3-DS2T derivatives. Highly n-doped silicon wafers (gate),
ꢂ
covered with thermally grown silicon oxide SiO2 (3000 A, in-
Acknowledgements
sulating layer), were purchased from Vegatec (France) or WRS
materials (USA) and used as device substrates. Trimethylsilation of
the Si/SiO2 surface was carried out by either exposing the silicon
wafers to hexamethyldisilazane (HMDS) vapor at room tempera-
ture in a closed air-free container under nitrogen for greater than
one week or by immersing the Si/SiO2 in a pure solution HMDS at
room temperature overnight. The capacitance per unit area of
either bare or HMDS deposition silicon dioxide dielectric layers
was 1.0e1.3ꢂ10ꢀ8 F/cm2. The semiconductor layer was vacuum
deposited onto the insulating layers to a nominal thickness of
50 nm as determined with an in situ quartz crystal monitor.
Substrate temperature (Tsub) during deposition was controlled by
heating the block on which the substrates are mounted. The de-
position control occurred in a three steps’ process: (i) during the
evaporator reached the right pressure, the substrates were cov-
ered by a shuttle to prevent deposition in the first stages of
evaporation, (ii) once the evaporation rate was constant at about
0.1e0.2 A/s, and (ii) the shuttle was opened and the deposition on
the substrates started. The first two steps are to prevent the de-
position of a high amount of impurities in the deposited layers.
The Au source and drain electrodes were evaporated on top of the
organic thin film through a shadow mask with specific channel
length and channel width W.
R.P.O. acknowledges funding from the European Community’s
Seventh Framework Programme through
a Marie Curie In-
ternational Outgoing Fellowship (Grant Agreement 234808).
References and notes
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ꢂ
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ꢂ
10 nm and below 0.30 A/s for the rest of the film. This method gives
well-defined channel lengths and channel widths, that are checked
by microscopy.
The source-drain current (ID) in the saturation regime is gov-
erned by the following equation: