48
RAKHLIN et al.
Parameters of deposited films produced from Me3SiNHNMe2 (I) and Me2HSiNHNMe2 (III)
Parameter
SiO2
Si3N4
PSG
Vapor–gas mixture composition
O2
I or III
N2 or NH3
I or III
Me3SiOP(OMe)2, O2
I or III
Layer deposition rate, Å/min
I: 90–186
III: 95–265
1.46
I: 100–1000
III: 100–1100
1.7–1.95
I: 1270–2268
III: 1940–2880
1.5
Refractive index
IR spectrum
1090 cm–1 (Si–O)
850 cm–1 (Si–N)
1050–1070 cm–1 (Si–O)
1325–1330 cm–1 (P=O)
1421–2366
Etching rate in BE*, Å/min
Etching rate in PCE**, Å/min
126–1673
220–340
70–1450
100–1270
920–960
* BE is a buffer etching solution (NH F + HF + H O).
4
2
** PCE is a plasmochemical etching medium (90% CF + 10% O ).
4
2
Compounds I–IV were studied as precursors for a three-necked flask equipped with a stirrer, dropping
deposition of silicon-containing thin-layer coatings by funnel, and reflux condenser; the solution was cooled to
decomposition in low-temperature plasma of a high- 5°ë, and a solution of 167 g (1.6 mol) of chlorotrime-
frequency electric discharge. Among these compounds, thylsilane in 200 mL of ether was added. The reaction
as expected, trimethyl(2,2-dimethylhydrazino)silane mixture was stirred for 1 h, heated under reflux for 1 h,
(I) and dimethyl(2,2-dimethylhydrazino)silane (III), and filtered, and the ether was distilled off. The yield of
which have the highest values of saturated vapor pres-
compound I was 113 g (86%), bp 98–100°C, n2D0
1.4016. Literature data [5]: bp 100°C, n2D0 = 1.4009,
d240 = 0.7692.
=
sure (bp 101 and 82°C, respectively), proved to be
promising reagents for thin-film technology. The depo-
sition of films based on compounds I and III onto sili-
con wafers was carried out on a UVP-2M setup. The
process was performed at 150–350°C. Depending on
the composition of the vapor–gas mixture (along with I
and III, we used the following gases: oxygen, nitrogen,
ammonia, and liquid volatile trimethylsilyl dimethyl
phosphite Me3SiOP(OMe)2), we obtained films of sili-
con dioxide, silicon nitride, and silicon dioxide doped
with phosphorus atoms (phosphosilicate glass). The
table shows the composition of the initial vapor–gas
mixtures, deposition conditions, and selected parame-
ters of the resulting coatings. The data of the table indi-
cate the applicability of the novel precursors for the
production of modern microelectronic devices.
For C6H16SiN2 anal. calcd. (wt %): C, 45.40; H, 12.19;
N, 21.18; Si, 21.23.
Found (wt %): C, 45.58; H, 12.26; Si, 21.36.
Dimethylbis(2,2-dimethylhydrazino)silane
Me2Si(NHNMe2)2 (II) was obtained from 37 g of 1,1-
dimethylhydrazine and 20 g of dichlorodimethylsilane
in 50 mL of ether. The yield of compound II was 13 g
(51%), bp 60°C (21 mmHg), n2D0 = 1.4287. Literature
data [6]: bp 62°C (22 mmHg), n2D0 = 1.4298, d420
0.8504. 1H NMR (CDCI3, δ, ppm): 0.02 (6H, Me–Si),
=
2.39 (12H, Me–N).
EXPERIMENTAL
Dimethyl(2,2-dimethylhydrazino)silane
Me2HSiNHNMe2 (III) was obtained from 150 g of
1,1-dimethylhydrazine and 119.2 g of chlorodimethyl-
silane in 250 mL of ether. The yield of compound III
1H and 29Si NMR spectra were recorded on a Bruker
DPX-400 spectrometer. The spectra were obtained for
10–20% solutions in CDCI3 using TMS, cyclohexane,
or hexamethyldisiloxane as an internal reference. Chem-
ical shifts are measured with an accuracy of 0.01 ppm
and reported on the δ scale.
1
was 121 g (83%), bp 80–82°C. H NMR (CDCl3, δ,
ppm): 0.17 (6H, Me–Si), 2.41 (6H, Me–N), 4.69 (2H,
H–Si).
For C4H14Si1N2 anal. calcd. (wt %): C, 40.63;
H, 11.93; N, 23.69; Si, 23.75.
GLC analysis was carried out on a Tsvet-500 chro-
matograph using a thermal conductivity detector, with
glass columns 3 m × 4 mm. The sorbent used was Iner-
ton-super with graining 0.125–0.150 mm, impregnated
with 10% PMS-1000.
Found (wt %): C, 39.98; H, 12.01; N, 23.48; Si, 24.53.
Methylbis(2,2-dimethylhydrazino)silane
MeHSi(NHNMe2)2 (IV). (1) The title compound was
obtained from 41 g of DMH and 40 g of
dichloro(methyl)silane in 200 mL of ether. The yield of
Trimethyl(2,2-dimethylhydrazino)silane
Me3SiNHNMe2 (I). Dimethylhydrazine (192 g, 3.2 mol)
dissolved in 200 mL of anhydrous ether was placed into compound IV was 34 g (61%), bp 71–73°C (33 mmHg),
DOKLADY CHEMISTRY Vol. 388 Nos. 4–6 2003