D194
Journal of The Electrochemical Society, 154 ͑3͒ D188-D194 ͑2007͒
References
1. S. Ono, M. Saito, M. Ishiguro, and H. Asoh, J. Electrochem. Soc., 151, B473
͑2004͒.
2. S. Ono, M. Saito, and H. Asoh, Electrochem. Solid-State Lett., 7, B21 ͑2004͒.
3. S. Ono, M. Saito, and H. Asoh, Electrochim. Acta, 51, 827 ͑2005͒.
4. Y. Yang and Q. Gao, Phys. Lett. A, 333, 328 ͑2004͒.
5. J. W. Diggle, T. C. Downie, and C. W. Goulding, Chem. Rev. (Washington, D.C.),
69, 370 ͑1969͒.
6. J. P. O’Sullivan and G. C. Wood, Proc. R. Soc. London, Ser. A, 317, 511 ͑1970͒.
7. J. Siejka, and C. J. Ortega, J. Electrochem. Soc., 124, 883 ͑1977͒.
8. K. Shimizu, K. Kobayashi, G. E. Thompson, and G. C. Wood, Philos. Mag. A, 66,
643 ͑1992͒.
9. V. F. Henley, Anodic Oxidation of Aluminium and Its Alloys p. 6, Pergamon Press,
Oxford ͑1982͒.
10. K. Nielsch, F. Muller, A.-P. Li, and U. Gosele, Adv. Mater. (Weinheim, Ger.), 12,
582 ͑2000͒.
11. W. G. Yelton, K. B. Pfeifer, and A. W. Staton, J. Electrochem. Soc., 149, H1
͑2002͒.
12. H. Chirac, A. E. Moga, M. Urse, and T.-A. Ovari, Sens. Actuators, A, 106, 348
͑2003͒.
13. S. W. Lin, S. C. Chang, R. S. Liu, S. F. Hu, and N. T. Jan, J. Magn. Magn. Mater.,
282, 28 ͑2004͒.
Figure 13. ͑Color online͒ Gas flux vs pressure Pd-Al2O3 composite mem-
brane after 4 depositions, each 3 min long, with intermediate reactivation in
bath buffered at pH 8.5 in the presence of Na2B4O7·H2O, T = 25 °C.
14. P. Ciambelli, D. Sannino, M. Sarno, and J. B. Nagy, Adv. Eng. Mater., 6, 804
͑2004͒.
15. T. Wu, I. C. Leu, J. H. Yen, and M. H. Hon, J. Phys. Chem. B, 109, 9575 ͑2005͒.
16. I. Z. Rahman, A. Boboc, K. M. Razeeb, and M. A. Rahman, J. Magn. Magn.
Mater., 290–291, 246 ͑2005͒.
17. Y. Piao, H. Lim, J. Y. Chang, W.-Y. Lee, and H. Kim, Electrochim. Acta, 50, 2997
͑2005͒.
18. X. Zhang, Y. Hao, G. Meng, and L. Zhang, J. Electrochem. Soc., 152, C664
͑2005͒.
19. J. Lee, Y. Yun, J. Oh, and Y. Tak, Electrochim. Acta, 51, 1 ͑2005͒.
20. R. C. Furneaux, W. R. Rigby, and A. P. Davidson, Nature (London), 337, 147
͑1989͒.
Conclusions
Electroless deposition of Pd onto AAM is limited by the amor-
phous nature of the support causing a significant dissolution in the
pH interval 9 ÷ 11, where the rate of deposition is maximum. Ex-
periments at pH 10 showed that after 3 min of immersion in the
plating bath an efficiency of Pd deposition of about 53% was
achieved, but pores were open and the surface of the membrane was
heavily damaged. As a result, different procedures were investigated
to form a dense metal layer and to find the best compromise between
bath utilization and membrane stability. The pH value was lowered
to 8.5 and it was controlled by two different buffers: NaHCO3 or
Na2B4O7·H2O. Despite the lower pH, dissolution of alumina oc-
curred at some extent, as evidenced by the presence on the surface
of white alumina/Pd clusters precipitated from the solution. This
behavior can be attributable to a local increase of pH due to Pd2+
reduction coupled with a local decrease of pH due to hydrazine
oxidation. Because the cathodic and anodic areas are in close prox-
imity, alumina dissolved from the cathodic areas precipitated on the
anodic ones. The local change of pH did not interfere with the pH of
the bulk solution which remained constant during the electroless
deposition of Pd.
Single and multiple depositions were carried out to form a dense
layer of Pd, and the best results were obtained by using the
Na2B4O7·H2O buffer. Multiple deposition steps were performed us-
ing a fresh plating bath after each step, and they were alternated
with reactivation steps to restore the surface concentration of cata-
lytic sites.
Permeability measurements showed the progressive closure of
the pores with the number of deposition steps. After four deposition
steps alternated with surface reactivation, a complete shutting of
pores was achieved, owing to the formation of a dense Pd layer
permeable only to H2 and He. The higher effectiveness of the plat-
ing bath containing Na2B4O7·H2O could be due to a lower solubility
of amorphous alumina in this solution. Further work is in progress to
clarify the transport mechanism of gases and to optimize the plating
process for a possible extensive use of these composite membranes
for gas separation processes.
21. P. P. Mardilovich, A. N. Govyadinov, N. I. Mukhurov, A. M. Rzhevskii, and R.
Paterson, J. Membr. Sci., 98, 131 ͑1995͒.
22. P. P. Mardilovich, A. N. Govyadinov, N. I. Mazurenko, and R. Paterson J. Membr.
Sci., 98, 143 ͑1995͒.
23. P. P. Mardilovich, A. N. Govyadinov, N. I. Mukhurov, A. M. Rzhevskii, and R.
Paterson J. Membr. Sci., 98, 131 ͑1995͒.
24. J. Randon, P. P. Mardilovich, A. N. Govyadinov, and R. Paterson J. Colloid Inter-
face Sci., 169, 335 ͑1995͒.
25. P. Bocchetta, C. Sunseri, A. Bottino, G. Capannelli, G. Chiavarotti, S. Piazza, and
F. Di Quarto, J. Appl. Electrochem., 32, 977 ͑2002͒.
26. P. Bocchetta, C. Sunseri, G. Chiavarotti, and F. Di Quarto, Electrochim. Acta, 48,
3175 ͑2003͒.
27. P. Bocchetta, C. Sunseri, R. Masi, S. Piazza, and F. Di Quarto, Mater. Sci. Eng., C,
23, 1021 ͑2003͒.
28. R. Dittmeyer, V. Hollein, and K. Daub, J. Mol. Catal. A: Chem., 173, 135 ͑2001͒.
29. E. Drioli and M. Romano, Ind. Eng. Chem. Res., 40, 1277 ͑2001͒.
30. T. P. Tiemersma, C. S. Patil, M. van Sint Annaland, and J. A. M. Kuipers, Chem.
Eng. Sci., 61, 1602 ͑2006͒.
31. S. Wieland, T. Melin, and A. Lamm, Chem. Eng. Sci., 57, 1571 ͑2002͒.
32. J. Tong, H. Suda, K. Haraya, and Y. Matsumura, J. Membr. Sci., 260, 10 ͑2005͒.
33. G. Xomeritakis and Y.-S. Lin, AIChE J., 44, 174 ͑1998͒.
34. S.-E. Nam, S.-H. Lee, and K.-H. Lee, J. Membr. Sci., 153, 163 ͑1999͒.
35. N. Itoh, N. Tomura, T. Tsuji, M. Hongo, Microporous Mesoporous Mater., 39, 103
͑2000͒.
36. J. N. Keuler, L. Lorenzen, R. N. Sanderson, and V. Linkov, Plat. Surf. Finish., 84,
34 ͑1997͒.
37. M. Volpe, R. Inguanta, S. Piazza, and C. Sunseri, Surf. Coat. Technol., 200, 5800
͑2006͒.
38. N. Feldstain, J. Electrochem. Soc., 121, 738 ͑1974͒.
39. A. M. T Van Der Putten., J. De Bakker, and L. G. J. Fakkink, J. Electrochem. Soc.,
139, 3475 ͑1992͒.
40. J. Horkans, J. Electrochem. Soc., 130, 311 ͑1983͒.
41. Y. S. Cheng and K. L. Yeung, J. Membr. Sci., 182, 195 ͑2001͒.
42. J. C. Serrano-Ruiz, G. W. Huber, M. A. Sanchez-Castillo, J. A. Dumesic, F.
Rodriguez-Reinoso, A. Sepulveda-Escribano, J. Catal., 241, 378 ͑2006͒.
43. G. Charlot, Les Reactions Chimiques En Solution, p. 402, Masson et Cie, Paris
͑1969͒.
44. A. R. West, Solid State Chemistry and Its Applications, p. 173 John Wiley & Sons
Ltd, Chichester ͑1985͒.
Acknowledgments
45. A. J. Burggraaf, in Fundamentals of Inorganic Membrane Science and Technology,
A. J. Burggraaf and L. Cot, Editors, p. 331, Elsevier Science B. V., Amsterdam
͑1996͒.
46. H. de L. Lyra and R. Paterson, J. Membr. Sci., 206, 375 ͑2002͒.
47. H. B. Zhao, K. Pflanz, J. H. Gu, A. W. Li, N. Stroh, H. Brunner, and G. X. Xiong,
J. Membr. Sci., 142, 147 ͑1998͒.
This work was supported financially by APQ Ricerca della Re-
gione Siciliana Delibera CIPE no. 17/2003, “Laboratorio
dell’Innovazione nel Settore dei Beni Culturali.”
The Universita di Palermo assisted in meeting the publication costs of
this article.
48. H. B. Zhao, G. X. Xiong, and G. V. Baron, Catal. Today, 56, 89 ͑2000͒.
Downloaded on 2015-03-12 to IP 141.210.2.78 address. Redistribution subject to ECS terms of use (see ecsdl.org/site/terms_use) unless CC License in place (see abstract).