011917-3
Ramana et al.
Appl. Phys. Lett. 92, 011917 ͑2008͒
more, Busch et al. reported the fast interfacial oxidation at
the ZrO2/Si based on oxygen diffusion at the crystalline
boundary.23 A higher oxygen diffusivity ͑103–104 times
faster͒ was also reported for polycrystalline ZrO2 than that in
the bulk crystal. We, therefore, conclude that thermally in-
duced structural modification of the ZrO2 film from amor-
phous to crystalline state causes the transition from slow to
fast interfacial oxidation zone.24
Summarizing the results, ZrO2 films were fabricated on
Si͑100͒ substrates using ion-beam assisted deposition, and
their surface/interface structure and optical properties were
investigated. HRTEM analysis reveals a 2 nm thick IL with a
refractive index profile similar to that of amorphous SiO2 as
determined from SE. The as-deposited ZrO2 films exhibit
profiles of optical constants corresponding to the amorphous-
ZrO2 phase. A two-step behavior is established for the high-
temperature annealing of ZrO2 at 900 °C as a function of
annealing time. The slow-rate growth of IL in zone I is due
to oxygen transport in amorphous ZrO2. The faster-rate
growth in zone II is attributed to the transition from disor-
dered to ordered state of ZrO2. Crystallization and grain
boundary formation in ZrO2 enhance oxygen diffusion
through the layer to the Si substrate and, hence, the oxidation
leading to the interfacial oxide layer at the ZrO2/Si interface.
FIG. 4. ͑Color online͒ The quantitative information obtained on the ZrO2
layers and interfacial SiO2 layer as a function of time of annealing at
900 °C. Linear fits to the data are shown with solid lines. The slow rate of
the IL with almost no change in ZrO2 film thickness in zone I is attributed to
the oxygen diffusion alone. The fast-rate growth rate of the IL along with a
slight decrease in ZrO2 film thickness observed in the zone II is attributed to
the oxygen diffusion coupled with structural transformation of ZrO2 from
amorphous to crystalline state.
but possible Zr-doping cannot be excluded. The growth rate
of IL is controlled by three elemental stages, namely, adsorp-
tion of oxygen on the top surface of ZrO2, diffusion through
the ZrO2 layer, and diffusion through the SiO2 layer to the
oxidation front at the interface SiO2/Si.
The authors at the University of Michigan acknowledge
the support of the National Science Foundation ͑NSF-NIRT,
EAR-0403732͒.
A model can be formulated to explain the observed ef-
fects of high-temperature annealing, stability, and growing
ILs of the ZrO2/Si system. The as-deposited ZrO2 layer is
completely amorphous as confirmed by RHEED and HR-
TEM observations. The IL thickness increases, with the time
of annealing, which is due to the oxidation of the ZrO2/Si
interface. Oxygen needed for this process is provided by the
interaction of the topmost surface layers with air at high
temperature. Subsequently, the diffusion of oxygen through
ZrO2 layer causes further oxidation of the Si substrate layers
into SiO2 or a mixed composition of ZrSixOy. The interesting
point is that the IL oxide growth as a function of annealing
time shows a two-step behavior ͑Fig. 4͒ with a clear distinc-
tion of two regions, which are labeled zone I and zone II.
The growth rate is rather slow in zone I, where the oxygen
transport is, perhaps, controlled by a slow-diffusion process
through the relatively thick amorphous ZrO2 layer at the sur-
face. Continued annealing for more than 3 h shows a transi-
tion of the oxidation behavior into zone II, where the growth
rate of the IL is fast. A slight decrease in thickness of the
ZrO2 layer is noticed corresponding to the fast-rate zone II.
This observation indicates the crystallization of the amor-
phous ZrO2 layer with increasing annealing time. Crystalli-
zation of amorphous ZrO2 results in a drastic shrinkage of
the film volume because of intensive crystal grain formation
with dense atomic packing and structural ordering. As a re-
sult, the interstitial diffusion mechanism of oxygen in ZrO2
becomes less important and oxygen transport is mainly taken
over by high-rate crystal grain boundary diffusion that facili-
tates the faster oxygen transportation to SiO2/Si interface.
Therefore, crystallization of ZrO2 with formation of grain
boundaries is mainly responsible for initiating zone II stage
of the oxidation process. Crystallization of ZrO2 at
700–900 °C as reported in several earlier studies13–15 and
confirmed by the RHEED pattern in the present work pro-
vides evidence that the change in oxidation behavior is due
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