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34124-45-3

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34124-45-3 Usage

Check Digit Verification of cas no

The CAS Registry Mumber 34124-45-3 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 3,4,1,2 and 4 respectively; the second part has 2 digits, 4 and 5 respectively.
Calculate Digit Verification of CAS Registry Number 34124-45:
(7*3)+(6*4)+(5*1)+(4*2)+(3*4)+(2*4)+(1*5)=83
83 % 10 = 3
So 34124-45-3 is a valid CAS Registry Number.

34124-45-3Relevant academic research and scientific papers

Preparation method of cationic polymerization bifunctional initiator and telechelic polyisobutene

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Paragraph 0023, (2017/09/18)

The invention discloses a preparation method of a novel cationic polymerization bifunctional initiator. The initiator is produced to a kilo grade scale meeting industrial production from a laboratory gram-grade scale, so that the synthetic cost of the initiator is greatly lowered. By developing a series of novel initiator derivatives, the brand new initiator which is higher in initiating efficiency, lower in energy consumption and higher in production efficiency are found, and telechelic polyisobutene, the functional groups (hydroxyl, double bonds or chlorine group) of which are fully terminated and the molecular structure of which is controllable, can be synthesized.

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

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, (2014/03/21)

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

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