Reference

Epoxy resin encapsulating compositions for semiconductors

Epoxy resin encapsulating compositions for semiconductors. (Mitsubishi Electric Corp., Japan). Jpn. 3388-04-3 and 3069-19-0 are also occured in this study. Kokai Tokkyo Koho JP 59008715 A2 18 Jan 1984 Showa, 5 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08G059-18; C08K005-54; C08L063-00; H01B003-40; H01L023-30. APPLICATION: JP 82-119378 7 Jul 1982. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 76 Potting compns. having excellent moisture resistance comprise epoxy resins, curing agents, and inorg. fillers, along with 0.15-2% (based on filler) coupling agent mixts. of C1-6 alkyl C1-5 alkoxy silanes or Ph C1-5 alkoxy silanes (A) and oxiranylalkyl trialkoxy silanes (B), with A/B ratio 0.3-10. Thus, cresol novolak epoxy resin 72, methylhexahydrophthalic anhydride 62, cryst. silica 350, carnauba wax 3, brominated epoxy resin 28, Sb2O3 10, carbon black 1, and 1,8-diazabicyclo[5.4.0]undec-7-ene 1 part were mixed with 0.3% (based on silica) Me(MeO)3Si (I) [1185-55-3] and 1% (g-glycidoxypropyl)trimethoxysilane (II) [2530-83-8], applied to semiconductor devices at 170° for 3 min, and cured at 180° for 8 h. The resulting devices had lifetime 1050 h in steam at 121° (2 atm), compared with 200 h for devices encapsulated using the same compn. without I, and 10 h using a compn. without I or II. .

Soluble ladder type of poly(silsesquioxanes) having functional groups

Soluble ladder type of poly(silsesquioxanes) having functional groups. Yamazaki, Noboru; Nakahama, Seiichi; Goto, Junichi; Nagawa, Takahiro; Hirao, Akira (Tokyo Inst. Technol., Tokyo 152, Japan). Contemp. Top. Polym. Sci., 4, 105-13 (English) 1984. 2768-02-7 and 2530-85-0 which are cas registry numbers are also used here. CODEN: CTPSDH. ISSN: 0160-6727. DOCUMENT TYPE: Journal CA Section: 35 (Chemistry of Synthetic High Polymers) PhSi(OMe)3 (I) [2996-92-1], MeSi(OMe)3 [1185-55-3], CH2:CHSi(OMe)3 (II) [2768-02-7], 3-glycidoxypropyltrimethoxysilane [2530-83-8], (3-methacryloyloxypropyl)trimethoxysilane (III) [2530-85-0], and (3-chloropropyl)trimethoxysilane (IV) [2530-87-2] were hydrolyzed with HCl to give homooligomers. I-II oligomer, I-III oligomer, and I-IV oligomer were also prepd. under the same conditions by simply mixing different silanes with each other. These oligomers were polymd. using alkali catalysts to give polymers having ladder structure, which were treated with living polystyrene to give graft copolymers. .