12019-69-1Relevant articles and documents
Preparation of Cu-Sn layers on polymer substrate by reduction-diffusion method using ionic liquid baths
Murase, Kuniaki,Ito, Akira,Ichii, Takashi,Sugimura, Hiroyuki
, p. D335-D341 (2011)
A novel metallization of non-conductive epoxy substrate with Cu-Sn "speculum alloy", or "white bronze", was performed through successive electrochemical processes: (i) conventional electroless deposition of pure Cu layer and (ii) subsequent electrochemical alloying of the resulting pure Cu layer with Sn using an ionic liquid bath at 150 °C, a medium-low temperature. Availability of the Sn quasi-reference electrode for the alloying was verified, and the resulting compact and adhesive Cu-Sn layers, composed of Cu6Sn5 and/or Cu3Sn intermetallic phases, were examined as an alternative to nickel plating. The abundance of the two intermetallic phases was found to be dependent on the alloying potential and duration, and was discussed in terms of alloy formation thermodynamics of the Cu-Sn system.
The thermochemical behavior of some binary shape memory alloys by high temperature direct synthesis calorimetry
Meschel,Pavlu,Nash
, p. 5256 - 5262 (2011)
The standard enthalpies of formation of some shape memory alloys have been measured by high temperature direct synthesis calorimetry at 1373 K. The following results (in kJ/mol of atoms) are reported: CoCr (-0.3 ± 2.9); CuMn (-3.7 ± 3.2); Cu3Sn
Nano-sized Cu6Sn5 alloy prepared by a co-precipitation reductive route
Salavati-Niasari, Masoud,Bazarganipour, Mehdi,Davar, Fatemeh
, p. 1796 - 1800 (2010)
Nano-sized Cu6Sn5 alloy powders were prepared by a co-precipitation reductive route using a hydrothermal method at 80 °C. The nano-size and morphology of the synthesized Cu6Sn5 alloy powders were evaluated by X-ray diffraction (XRD), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The obtained morphologies, chemical compositions are comparatively discussed. A variety of synthesis parameters, such as time, capping agent and sort of reductant, has an effect on the morphology of the obtained materials, and will be particularly highlighted.
Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds
Flandorfer,Saeed,Luef,Sabbar,Ipser
, p. 34 - 39 (2007)
Standard enthalpies of formation were determined for a number of binary intermetallic compounds in the systems Ag-Sn, Cu-Sn, and Ni-Sn by means of solution calorimetry in liquid Sn in a Calvet-type microcalorimeter. For the pure elements Ag, Cu, and Ni, t
In situ X-ray study of the electrochemical reaction of Li with η′-Cu6Sn5
Larcher,Beaulieu,MacNeil,Dahn
, p. 1658 - 1662 (2000)
The electrochemical reaction of lithium with crystalline intermetallic η′-Cu6Sn5 has been studied by means of in situ X-ray diffraction. The reaction of Li with Cu6Sn5 proceeds in two distinct steps. A first discharge plateau at approximately 0.4 V vs. Li is attributed to the coexistence of Cu6Sn5 and a ternary Li2CuSn-type phase. Upon further reaction Li2CuSn coexists with a Li-rich tin phase (Li4.4Sn) and metallic Cu at a potential below 0.1 V. During the charge, the initial intermetallic is reformed in a multistep reaction. First, some Li can be removed from Li4.4Sn making Li4.4-xSn with the same structure. As Li is removed from Li4.4-xSn it reacts with the available Cu to make Li2CuSn. Then, lithium can be removed from Li2CuSn, making vacancies in the structure to form Li2-xCuSn. When x in Li2-xCuSn reaches about 1, the removal of further lithium results in the formation of a second phase, Cu6Sn5. The 0.8 V plateau during the charge of Li/Cu6Sn5 cells is associated with this coexistence of Li2-xCuSn and Cu6Sn5. The in situ experiments show that both the Li4.4Sn and the Li2CuSn phases can exhibit a range of Li stoichiometries, especially as Li is removed from their structures. When Li/Cu6Sn5 cells are charged and discharged above the lower plateau, to prevent the continual expulsion and reincorporation of Cu from the cathode grains, better cycling is obtained than when cycling includes the lower plateau where metallic copper is formed.
Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joints on Si wafers
Kim,Tu,Totta
, p. 2204 - 2206 (1996)
In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu6Sn5 spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface at the bottom of the solder joint. It suggests that gravity plays a role.
Influence of the preparation conditions on the morphology and electrochemical performance of nano-sized Cu-Sn alloy anodes
Wang, Fei,Zhao, Mingshu,Song, Xiaoping
, p. 249 - 253 (2007)
Nano-sized Cu-Sn alloy powders were prepared by reductive precipitation method combining with the aging treatment in constant temperature water bath at 80 °C. The microstructure, morphology and electrochemical property of synthesized Cu-Sn alloy powders w
Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates
Gu, Yue,Zhao, Xiuchen,Li, Yi,Liu, Ying,Wang, Yong,Li, Zhenyu
, p. 39 - 47 (2015)
In the present study, Fe2O3 nanoparticles were synthesized and smelted with pure Sn, Ag, and Cu to prepare Sn-1.0Ag-0.7Cu-xFe2O3 nano-composite solders. The content of Fe2O3 nanoparticles r
Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn-Bi-based solder alloys
Shen, Jun,Pu, Yayun,Yin, Henggang,Luo, Dengjun,Chen, Jie
, p. 63 - 70 (2014)
The effects of Cu and Zn additions on microstructures, thermal and mechanical properties of Sn-Bi-based solder alloy were investigated. Thermal analysis indicated that Cu addition decreased both melting point and paste region of Sn-Bi-based solder while Zn played a reverse effect. Alloying Cu into binary solder resulted in an increase in both ultimate tensile strength and ductility. The improved strength of the Sn-40Bi-0.1Cu solder was attributed to the microstructural refinement and uniform distribution of the Cu 6Sn5 intermetallic particles. The addition of Zn further depressed the precipitation of Bi, formed uniform globular CuZn2 particles as well as flat blocky Cu5Zn8 phase. The enhanced strength of Zn-containing solder was ascribed to the presence of the globular CuZn2 particles and structural refinement. Needle-like Zn with high aspect ratio forms at the position around the Bi-rich phase and leads a significant decrease of the elongation of Sn-40Bi-2Zn-0.1Cu solder. Fracture surface analysis indicated that the addition of Cu and Zn in Sn-Bi-based solder alloy did not affect the mode of fracture, and all tested solder exhibited brittle fracture with a pattern mixing with tongue and cleavage on the fracture surface.
Carbon-coated copper-tin alloy anode material for lithium ion batteries
Liu, Sheng,Li, Qi,Chen, Yuxi,Zhang, Fengju
, p. 694 - 698 (2009)
Carbon-coated copper-tin alloy powders were prepared by heating of mixtures of thermoplastic poly(vinyl alcohol) and nano-sized copper-tin alloy particles in argon atmosphere. The products were characterized by X-ray diffraction (XRD), thermogravimetric a
