1745-89-7Relevant articles and documents
THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND
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Paragraph 0415; 0416; 0420, (2018/06/15)
The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.
ALKOXYSILYL COMPOUND HAVING AT LEAST TWO ALKOXYSILYL GROUPS, COMPOSITION, CURED PRODUCT THEREOF, USE THEREOF AND PREPARING METHOD OF ALKOXYSILYL COMPOUND HAVING AT LEAST TWO ALKOXYSILYL GROUPS
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Paragraph 0702; 0705; 0706; 0712, (2016/12/07)
The present invention relates to an alkoxysilyl compound having two or more alkoxysilyl groups (hereinafter, referred to as ″alkoxysilyl compound″) showing an excellent heat-resistance in a composite, a composition and a cured product comprising the same, an use thereof, and a method for preparing the alkoxysilyl compound. The alkoxysilyl composition comprising the novel alkoxysilyl compound, according to the present invention, in a composite, shows improved heat-resistance, i.e., an effect of decreasing CTE of the alkoxysilyl composition, or an effect of increasing glass transition temperature or not showing glass transition temperature (hereinafter, referred to as ″Tg less″) by forming a chemical bond between the alkoxysilyl group and a filler (fibers and/or particles). Further, the cured product comprising the alkoxysilyl compound according to the present invention shows an excellent flame retardant property due to the alkoxysilyl group. Moreover, when the alkoxysilyl composition according to the present invention is applied to a metal film of a substrate, an excellent adhesion to the metal film is exhibited due to a chemical bond between a functional group on a surface of the metal film and the alkoxysilyl group.
COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP
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Page/Page column, (2015/06/03)
There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.