is observed with pores in the range of
2–100 nm. For highly resistive crystalline
and amorphous p-type silicon, macropore
formation (0.4–10 ꢃm in diameter) is ob-
served below a thin layer of nanopores.13,14
Previously, macropore formation in low-
doped Si had been reported in anhydrous
electrolyte.15,16 The wall thickness is about
two times the space-charge region, whereas
the interpore distance is governed by the
properties of the silicon–electrolyte inter-
face, the resistivities of the silicon wafer,
Electrochemically
Prepared Pore
Arrays for Photonic-
and the properties of the electrolyte.17,18
A
detailed description of macroporous sili-
con formation in n-type Si can be found in
References 7 and 19. Since in n-type silicon
holes are minority carriers, the holes have
to be generated by back-side illumination.
Then they diffuse to the etch front through
the wafer. This technique puts high de-
mands on the minority carrier diffusion
length, so normally float-zone (FZ) wafers
are used. Since in this technique the holes
move by diffusion and not by drift as in
the p-type case, the strong boundary con-
dition is relaxed and thicker walls can
be obtained—up to 10 times the space-
charge region width.20 To obtain ordered
arrangements of pores, an n-type silicon
wafer with ꢀ100ꢁ orientation is first pre-
patterned by standard photolithography.
Subsequent alkaline etching produces in-
verted pyramids acting as initial pores.
Under anodic bias and back-side illumina-
tion, the wafer is then etched in hydro-
fluoric acid. The electronic holes generated
by the illumination near the back surface
diffuse through the whole wafer and pro-
mote the dissolution of silicon mainly
at the pore tips. As a result, pores grow
straight along the [100] direction with
very high aspect ratios. The arrangement
of these pores can be controlled by the
lithographic mask, and the pore diameter
can be controlled by the illumination in-
tensity. By controlling these parameters,
variations of the pore diameter with depth
can be made negligible. Figure 1 shows a
scanning electron microscope (SEM) image
of a porous Si sample, which was etched
on 0.5 ꢄ cm n-type FZ silicon substrates
having a photolithographically defined
hexagonal pore arrangement. The pores
have a center-to-center distance of 1.5 ꢃm
and a depth of 100 ꢃm. The pore diameter
after electrochemical etching is 0.9 ꢃm. By
subsequent oxidation/etching steps, the
pore diameter is increased to up to 1.36 ꢃm.
The beveled edge in Figure 1 shows the
very good depth homogeneity of the pore
diameter.
Crystal Applications
R.B.Wehrspohn and J. Schilling
Introduction
In the last few years, photonic crystals
monodomain porous alumina structures
with sizes in the micrometer range.
have gained considerable interest due to
their ability to “mold the flow of light.”1
Photonic crystals are physically based on
Bragg reflections of electromagnetic waves.
In simple terms, a one-dimensional (1D)
photonic crystal is a periodic stack of thin
dielectric films with two different refrac-
tive indices, n1 and n2. The two important
geometrical parameters determining the
wavelength of the photonic bandgap are
the lattice constant, a ꢀ d1(n1) ꢀ d2(n2), and
the ratio of d1 to a (where d1 is the thickness
of the layer with refractive index n1, and d2
is the thickness of layer n2). For a simple
quarter-wavelength stack, the center wave-
length ꢁ of the 1D photonic crystal would
be simply ꢁ ꢀ 2n1d1 ꢀ 2n2d2. In the case
of 2D photonic crystals, the concept is
extended to either airholes in a dielectric
medium or dielectric rods in air. There-
fore, ordered porous dielectric materials
like porous silicon or porous alumina are
intrinsically 2D photonic crystals.
Electrochemically grown pores in metals
and semiconductors2,3 have been studied
for about 50 years. However, only in the
last 10 years have intense research efforts
enabled the preparation of ordered arrays
of pores with pore diameters in the range
of a few nanometers to some tens of micro-
meters. The most studied materials are
porous alumina and macroporous silicon.
Porous alumina has been known for more
than a century, but only in 1995 was it first
observed that ordered arrays of porous
alumina could be achieved.4 This ordering
was initially by self-organization, and the
ordered domains were in the micrometer
range. However, electron-beam lithogra-
phy5 and a related new technique, nano-
indentation,6 allowed the preparation of
Macroporous silicon was pioneered in
the early 1990s by Lehmann and Föll.7
Very regular pore arrays in the microme-
ter range have been obtained by photo-
lithographic prepatterning. These pores
were called macropores (in contrast to
microporous silicon, which is a sponge-
like nanostructured material with photo-
luminescent properties that was also
intensively studied in the early 1990s).8
Moreover, recently a few other semi-
conductors like InP, GaAs, and GaP have
been shown to exhibit micrometer-sized
pores.9,10 Whereas standard nanostructur-
ing techniques are limited to small pore
aspect ratios (h/d ꢂ 40), and resolutions
are limited by lithographic tools, electro-
chemically prepared pores exhibit high
aspect ratios of 100–10,000 and inherent
short-range order. In the following, two
materials will be discussed in detail: macro-
porous silicon and porous alumina. Due
to the regular pore arrangements, these
materials are extremely well suited as
photonic crystals.
Macroporous Silicon
Porous silicon formed by the anodiza-
tion of p-type silicon in hydrofluoric acid
has been studied by numerous groups.
A current state-of-the-art summary is
given by Allongue.11 Three different pore-
formation regimes have been observed
experimentally as a function of the dopant
concentration. For degenerately doped
p-type silicon, a special type of mesopore
observed experimentally has been attrib-
uted to tunneling of holes through the
space-charge region.12 For moderately
doped p-type silicon, nanopore formation
Porous Alumina
Aluminum is electrochemically oxidized
to alumina (Al2O3) under positive polari-
MRS BULLETIN/AUGUST 2001
623