7
32
T. KINGETSU et al.
Vol. 33, No. 5
of various SiC samples have been studied extensively so far: SiC single crystals [1–3], SiC
polycrystalline synthesized through powder sintering [4] and chemical vapor deposition
(CVD) [5] methods, and SiC/SiC composite [6]. Many of those studies were concentrated on
the amorphous silica formation and growth at temperatures below 1780 K. The growth
kinetics of cristobalite with the coexistence of amorphous silica on SiC is not well under-
stood, since an overall feature, such as mass gains or oxide layer thicknesses, was used as a
measure of oxide growth in most of the previous studies.
As for studies on oxidation kinetics using in situ X-ray diffractometry (XRD), little
research work has been published to date. With conventional X-ray diffractometers, X-ray
detectors are -scanned mechanically and, thus, it takes about a half hour to detect all
diffracted X-rays needed for analysis. Hence, the obtained XRD profile shows only an
average of the structural change of the sample crystal upon heating for such a long time of
scan. In contrast, the X-ray detection system in our study has an imaging plate that can detect
the X-ray signals diffracted at various angles simultaneously, and the cumulation of the
signals to the sufficient level requires only a few minutes or less. This enables us to detect
the structural change of a crystalline sample upon heating, nearly at real time. The aim of this
paper is to demonstrate the use of high temperature in situ XRD analysis for study of oxide
crystal growth and to present the results on growth kinetics of cristobalite with the coexist-
ence of amorphous silica on CVD-SiC films. In the present paper, growth of cristobalite
means increase in the amount of cristobalite and includes both forms of increase in a solid
phase: nucleation and growth.
EXPERIMENTAL
SiC films with a thickness of about 50 m were deposited on isotropic graphite (IG-11, Toyo
Tanso Co., Japan) strips (7 mm in width and 1 mm in thickness) by thermally activated CVD.
Here, several substrate strips were loaded simultaneously in a CVD furnace for one batch of
CVD process in order to ensure the same quality of the SiC film for each substrate. SiCl and
4
CH gases diluted by H gas were employed as the gaseous precursors, and the growth
4
2
temperature was 1523 K. The crystal structure, surface morphology, microstructure in cross
section, and thickness of the films were characterized by conventional XRD analysis (–2
scans), optical microscopy, and scanning electron microscopy (SEM). SiC films in the
present study were confirmed to have no cracks. The films were characterized to have

-(3C)–SiC crystal grains oriented nearly at random with sizes less than 5 m, and the film
surfaces were less pebbled with pebbles less faceted. Details of specimen preparations and
features of the films will appear elsewhere [7].
Oxidation tests were conducted in open air by letting electric current pass directly through
the graphite specimen strips. Test temperatures were 1803 and 1873 K and duration was up
to 14.4 ks. The heating rate from room temperature to the test temperature was 0.83 K/s. The
specimen surfaces were observed directly during heating. XRD analyses (2 scans) with a Cu
K␣ X-ray source were performed in situ using a diffractometer with a so-called imaging plate
X-ray detector (DIP300/MXP18, MAC Science, Japan). The system consists of a Debye-
Scherrer camera with a radius of 150 mm, an X-ray sensitive two-dimensional detector
(photostimulable phosphor film), and a specimen heating system in a closed environment.
The incident angle () of X-rays into the specimen surface is 6°, which corresponds to an
X-ray penetration depth of about 100 micrometers for SiO . Presence of oxygen atoms on the
2