1
762
Journal of The Electrochemical Society, 147 (5) 1758-1762 (2000)
S0013-4651(99)07-097-X CCC: $7.00 © The Electrochemical Society, Inc.
Turning now to the frequency responses in the presence of BTAH
curve bЈ) and TTAH (curve cЈ) in the solution, the same features are
References
(
1. S. L. F. A. da Costa and S. M. L. Agostinho, Corrosion, 45, 472 (1989).
2
3
.
.
R. Alkire and A. Cangellari, J. Electrochem. Soc., 136, 913 (1989).
S. F. L. A. da Costa, S. M. L. Agostinho, and J. C. Rubim, J. Electroanal. Chem.,
present, although there are significant changes in their magnitude. In
the case of TTAH, the frequency shift is more than two times small-
er than that in the inhibitor-free solution. The observed change in
mass confirms the possibility of co-adsorption of Cu(I) and BTAH as
postulated in earlier papers. However, the formation of mixed-ligand
2
95, 203 (1990).
4
.
S. F. L. A. da Costa and S. M. L. Agostinho, J. Electroanal. Chem., 296, 51 (1990).
5. C. Clerc and R. Alkire, J. Electrochem. Soc., 138, 25 (1991).
6.
7.
8.
D. Tromans and R.-h. Sun, J. Electrochem. Soc., 138, 3235 (1991).
T. Aben and D. Tromans, J. Electrochem. Soc., 142, 398 (1995).
D. Jope, J. Sell, H. W. Pickering, and K. G. Weil, J. Electrochem. Soc., 142, 2170
complexes, Cu Cl-BTA, which were suggested by Hashemi and Hog-
2
53
arth, cannot be excluded. It seems that the adsorption of BTAH on
the Pt surface results in the forming a new complex with cuprous and
BTA- or TTA- ions. Consequently, the observed mass responses
should monitor two opposed processes: (i) formation of the highly
insoluble Cu(I)-BTA or Cu(I)-TTA complexes, respectively, on the
electrode surface, which leads to a mass gain, and (ii) partial release
of BTAH or TTAH into solution, which is potential dependent and
leads to a mass loss. Moreover, there is an additional mass gain dur-
ing the production of Cu(I) on the electrode in the additive-free solu-
tion, which results from co-adsorption of chloride anions.
(1995).
9. D. Tromans and J. C. Silva, J. Electrochem. Soc., 143, 458 (1996).
10. R. M. Suoto, V. Fox, M. M. Laz, M. Perez, and S. Gonzales, J. Electroanal. Chem.,
4
11, 161 (1996).
1. M. R. Vogt, W. Polewska, O. M. Magnussen, and R. J. Behm, J. Electrochem. Soc.,
44, L113 (1997).
12. D. Tromans and J. C. Silva, Corrosion, 53, 16 (1997).
13. D. Tromans, J. Electrochem. Soc., 145, L42, (1998).
4. M. Metikos-Hukovic, R. Babic, and A. Marinovic, J. Electrochem. Soc., 145, 4045
1998).
5. M. Fonsati, F. Zucchi, and G. Trabanelli, Electrochim. Acta, 44, 311 (1998).
6. E. Stupnisek-Lisac, A. L. Bozic, and I. Cafuk, Corrosion, 54, 713 (1998).
1
1
1
(
1
1
Upon further potential change below Ϫ0.3 V the resonant fre-
quency sharply decreases in concert with bulk deposition of metallic
copper reflected in the voltammetric characteristics. This response
can be related to desorption of the protecting film (see Fig. 5, curves
b and c). The above potential limit of the Cu(I)-BTA adsorption, is
in good agreement with that reported by Vogt et al.17 for Cu(100)
surface in 0.1 M HCl. However, this comparison may be question-
able since the adsorption occurs on surfaces of different metals and,
consequently, the structures of the films formed may be different.
17. M. R. Vogt, R. J. Nichols, O. M. Magnussen, and R. J. Behm, J. Phys. Chem. B,
02, 5859 (1998).
1
1
1
8. H. Y. H. Chant and M. J. Weaver, Langmuir, 15, 3348 (1999).
9. J. F. Walsh, H. S. Dhariwal, A. Gutierrez-Sosa, P. Finetti, C. A. Muryn, N. B.
Brookes, R. J. Oldman, and G. Thornton, Surf. Sci., 415, 423 (1998).
20. E. E. Farndon, F. C. Walsh, and S. A. Campbell, J. Appl. Electrochem., 25, 574
(1995).
2
1. W. U. Schmidt, R. C. Alkire, and A. A. Gewirth, J. Electrochem. Soc., 143, 3122
1996).
2. R. C. Alkire and E. D. Eliadis, Z. Phys. Chem., 208, 1 (1999).
(
2
23. L. Ciavatta and M. Iuliano, Ann. Chim. (Rome), 88, 71 (1998), and the references
cited therein.
2
4. R. Arnek, I. Puigdomenech, and M. Valiente, Acta Chem. Scand. A, 36, 15 (1982),
Conclusions
and the references cited therein.
Experimental observation on the cathodic reduction of Cu(II) at
poly-oriented platinum from acidic 1 M NaCl solutions led us to the
following conclusions.
25. T. Kekesi and M. Isshiki, J. Appl. Electrochem., 27, 982 (1997).
2
6. J. Malyszko, S. Michalkiewicz, D. Goral, and M. Scendo, J. Appl. Electrochem.,
8, 107 (1998).
2
2
7. M. Scendo and J. Malyszko, Monatsh. Chem., 128, 123 (1997).
1
. The overall electrode process Cu(II)/Cu(I) involves two one-
2
8. D. T. Napp, D. C. Johnson, and S. Bruckenstein, Anal. Chem., 39, 481 (1967).
electron reactions: Cu(II)/Cu(I) and Cu(I)/Cu, which are character-
ized by a very large potential separation. In the additive-free solu-
tions, the first electrode reaction is slightly inhibited by UPD of Cu
on the electrode surface.
29. M. Zhou, N. Myung, X. Chen, and K. Rajeshwar, J. Electroanal. Chem., 398, 5
(1995).
3
3
0. I. C. Raducanu and W. J. Lorenz, Electrochim. Acta, 16, 1143 (1971).
1. J. Lipkowski, Cl. Buess-Herman, J. P. Lambert, and L. Gierst, J. Electroanal.
Chem., 202, 169 (1986).
2. The electron-transfer reaction Cu(II)/Cu(I) was strongly inhib-
32. R. Greef, R. Peat, L. M. Peter, D. Pletcher, and J. Robinson, Instrumental Methods
in Electrochemistry, Chap. 7.2, Ellis Horwood, Chichester (1985).
ited by the additives used while the ion-transfer reaction Cu(I)/Cu
remained practically unaffected. Both inhibitors, BTAH and TTAH,
behave in a similar manner to each other.
3
3
3
3. G. Sauerbrey, Z. Phys., 155, 206 (1959).
4. V. Tsionsky, L. Daikhin, and E. Gileadi, J. Electrochem. Soc., 143, 2240 (1996).
5. G. Zilberman, V. Tsionsky, and E. Gileadi, Can. J. Chem., 75, 1674 (1997).
3. The adsorption of BTAH and TTAH on the Pt surface is poten-
36. V. Tsionsky, L. Daikhin, G. Zilberman, and E. Gileadi, Faraday Discuss., 107, 337
tial dependent. The adlayers of these inhibitors are removed in the
potential range below Ϫ0.25 V, in which the adsorption of hydrogen
occurs.
(1997).
37. R. Schumacher, Angew. Chem. Int. Ed. Engl., 29, 329 (1990).
38. E. Juzeliunas and K. Jüttner, J. Electrochem. Soc., 145, 53 (1998).
39. E. Juzeliunas and K. Jüttner, Electrochim. Acta, 43, 1691 (1998).
40. D. A. Buttry and M. D. Ward, Chem. Rev., 92, 1355 (1992).
4
. The Cu(II)/Cu(I) electron-transfer reaction occurs in the poten-
tial range of BTAH and TTAH adsorption and thus is strongly inhib-
ited by these additives. The inhibition mechanism involves forma-
tion of a thin layer of Cu(I)-BTA or Cu(I)-TTA complex, respective-
ly, in polymeric form on the electrode surface.
41. R. Michaelis, M. S. Zei, R. S. Zhai, and D. M. Kolb, J. Electroanal. Chem., 339,
99 (1992).
2
4
4
4
4
4
2. N. M. Markovic and P. N. Ross, Langmuir, 9, 580 (1993).
3. H. S. Yee and H. D. Abruna, Langmuir, 9, 2460 (1993).
4. H. Matsumoto, J. Inukai, and M. Ito, J. Electroanal. Chem., 379, 223 (1994).
5. N. M. Markovic, H. A. Gasteiger, and P. N. Ross, Langmuir, 11, 4098 (1995).
6. N. M. Markovic, H. A. Gasteiger, C. A. Lucas, I. M. Tidswell, and P. N. Ross, Surf.
Sci., 335, 91 (1995).
Acknowledgments
This research was supported in part with funds from Inwex,
Kielce. The authors thank Professor Z. Galus from the University of
Warsaw for a critical reading of this manuscript and several helpful
suggestions.
47. M. Moreau, Electrochim. Acta, 26, 1609 (1981).
48. C. E. Yeow and D. B. Hibbert, J. Electrochem. Soc., 130, 786 (1983).
49. H. P. Lee, K. Nobe, and A. J. Pearlstein, J. Electrochem. Soc., 132, 1031 (1985).
50. J. Crousier, L. Pardessus, and J.-P. Croussier, Electrochim. Acta, 33, 1039 (1988).
51. M. Itagaki, M. Tagaki, and K. Watanabe, Corros. Sci., 38, 1109 (1996).
52. M. E. Vela, G. Andreasen, S. G. Aziz, R. C. Salvarezza, and A. J. Arvia, Elec-
trochim. Acta, 43, 3 (1998).
Pedagogical University assisted in meeting the publication costs of this
article.
53. T. Hashemi and C. A. Hogarth, Electrochim. Acta, 33, 1123 (1988).