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A. Sinha, B.P. Sharma / Materials Research Bulletin 37 -2002) 407±416
performance advantages over precious metals. The conductivity of copper is as good
as silver and 40% better than that of gold. The stability of copper at high frequencies is
better than gold or silver and it is compatible with most solder materials [1].
For conductive paste application, it is required to use high purity crystalline non-
agglomerated copper powder, which is free from surface oxidation. The oxidation of
the powder leads to the formation of a thick ®lm conductor with bad appearance and
poor solderability. In addition to the purity, it is highly desirable that the particles
should have narrow size distribution in order to precisely control the thickness of the
electrode formed with the conductive paste and also facilitate intimate metal bonding
[2].
Reduction of metallic compounds by gases is a widely employed method of
producing metal powders. Gases such as hydrogen, dissociated ammonia, carbon
monoxide, partially combusted hydrocarbon are few of the examples of the reducing
agents used. Copper powder can be produced by atomization, electrolysis, reduction
of sulfate solution using hydrogen and by solid-state reduction. Each of these pro-
cesses, however, produces particles of varying physical properties. Among the various
methods of preparation of copper powders, chemical routes facilitate molecular/
atomic level controls and also ef®cient scale up for processing and production [3].
Precipitation of metallic copper is accomplished through chemical reduction of a salt,
oxide, or hydroxide of copper in solution. Various reducing agents like starch [4],
hydrazine [5], hydroxylammine hydrochloride [6] etc. have been used for the
production of copper powder.
One of the successful methods for preparation of metal powders belonging to
groups VIII and IB is the so-called polyol process [7]. The polyol process essentially
involves preparation of metal powders by heating a suitable inorganic/organic
metallic salt in a polyol, which acts as a solvent as well as a reducing agent.
In the polyol process metal particles are formed through nucleation and growth
steps from the solution. The synthesis of metal powders of well-de®ned particle
shape and size with controlled size distribution is facilitated by the kinetic control of
the nucleation and growth steps. De®nite separation between the nucleation and the
growth stages is a prerequisite for the formation of mono-size particles [7]. One of
the measures to separate growth from nucleation may be addition of seed particles
where seed crystals act as foreign nuclei and homogeneous nucleation is thereby
replaced by heterogeneous nucleation.
Fievet et al. [7] has described a process for preparation of metal powder using
ethylene glycol/diethylene glycol as a polyol. In the present study, a process for
preparation of copper powder having narrow size distribution is described using
glycerol. Glycerol is having higher boiling point and dielectric constant compared to
other polyols ꢀTable 1). Due to its higher boiling point, it can provide higher reaction
temperature at atmospheric pressure. Due to the presence of one secondary and two
primary alcoholic groups in its structure, glycerol can reduce salts of easily reducible
metals. Though ethylene glycol, diethylene glycol, or their mixtures have been
studied for preparation of metal powders, the use of glycerol to prepare metal powders
has not been investigated.