108-65-6 Usage
Description
Propylene glycol methyl ether acetate (PGMEA), also known as propylene glycol monomethyl ether acetate, with molecular formula of C6H12O3, is a colorless hygroscopic liquid with special smell. It is a non pollution solvent with multi-functional groups. It is mainly used as the solvent of ink, paint, ink, textile dye and textile oil agent, and also as the cleaning agent in the production of LCD. Flammable, may form explosive vapor / air mixture above 42 ° C. Propylene glycol methyl ether acetate (PGMEA) is an advanced solvent. Its molecule has both ether bond and carbonyl. Carbonyl forms the structure of ester and contains alkyl at the same time. In the same molecule, there are both non-polar and polar parts. The functional groups of these two parts not only restrict and repel each other, but also play their inherent roles. Therefore, it has a certain solubility for non-polar substances and polar substances.1-Methoxy-2-propyl acetate (PGMEA) is a material contains polar groups and non polar group , has good ability of dissolving and coupling, commonly used in solvent based coatings and screen printing ink. Using dipropylene glycol methyl ether and acetic acid as raw material, under the catalysis of solid acid, via esterification reaction to generated crude product and its high purity PGMEA after distillation.
Chemical Properties
1-Methoxy-2-propyl acetate(Methoxypropyl Acetate) is a clear, slightly hygroscopic liquid with a mild odour. It is freely miscible with most common organic solvents, but has only limited miscibility with water.By virtue of its ether and ester groups, Methoxypropyl Acetate enters into reactions that are characteristic of ethers and esters and display their solvent power. For instance, it dissolves numerous natural and synthetic resins, waxes, fats and oils.Since Methoxypropyl Acetate may react with the oxygen in the air to form peroxides, BASF supplies it inhibited with 2.6-di-tert-butyl-para-cresol (butylated hydroxytoluene – BHT).
Uses
1,2-Propanediol monomethyl ether acetate is used as a solvent for paints, inks, lacquers, varnishes, cleaners and coatings. It is also used as a solvent for degreasing circuit boards and in food contact applications. Further, it is used in photoresist formulations in the semiconductor industry.
Application
1-Methoxy-2-propyl acetate is a high-grade industrial solvent with low toxicity and excellent performance. It has strong solubility for polar and non-polar substances. It is suitable for solvents of various polymers of high-grade coatings and inks, including aminomethyl ester, vinyl, polyester, cellulose acetate, alkyd resin, acrylic resin, epoxy resin and nitrocellulose. Among them. Propylene glycol methyl ether propionate is the best solvent in coatings and inks. It is suitable for unsaturated polyester, polyurethane resin, acrylic resin, epoxy resin, etc.
General Description
Propylene glycol monomethyl ether acetate (PGMEA) is a photoresist solvent. Its degradation by microorganisms in different soil types has been investigated. An oral reference dose (RfD) value of PGMEA has been obtained from inhalation studies. The solubility of (5-alkylsulfonyloxyimino-5H-thiophen-2-ylidene)-2-methylphenyl-acetonitriles in PGMEA has been analyzed.
Flammability and Explosibility
Flammable
Safety Profile
Moderately toxic by
intraperitoneal route. Slightly toxic by
ingestion and skin contact. When heated to
decomposition it emits acrid smoke and
irritating vapors.
Check Digit Verification of cas no
The CAS Registry Mumber 108-65-6 includes 6 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 3 digits, 1,0 and 8 respectively; the second part has 2 digits, 6 and 5 respectively.
Calculate Digit Verification of CAS Registry Number 108-65:
(5*1)+(4*0)+(3*8)+(2*6)+(1*5)=46
46 % 10 = 6
So 108-65-6 is a valid CAS Registry Number.
InChI:InChI=1/C5H10O3.C3H6/c1-5(6)8-4-3-7-2;1-3-2/h3-4H2,1-2H3;3H,1H2,2H3
108-65-6Relevant articles and documents
Pattern-forming method, and radiation-sensitive composition
-
, (2016/06/01)
A pattern-forming method includes providing a resist film on a substrate using a radiation-sensitive composition. The resist film is exposed. The exposed resist film is developed using a developer solution. The developer solution includes no less than 80% by mass of an organic solvent. The radiation-sensitive composition includes at least two components including a first polymer and a radiation-sensitive acid generator. The first polymer includes a structural unit having an acid-labile group. One or more components of the radiation-sensitive composition have a group represented by a formula (1). A? represents —N?—SO2—RD, —COO?, —O? or —SO3?. —SO3? does not directly bond to a carbon atom having a fluorine atom. RD represents a linear or branched monovalent hydrocarbon group, or the like. X+ represents an onium cation. [in-line-formulae]-A? X+??(1)[/in-line-formulae]
Photoresist composition, resist pattern-forming method, compound, acid generating agent, and photodegradable base
-
, (2016/05/24)
A photoresist composition containing a polymer having a structural unit including an acid-labile group, and a compound represented by the formula (1). In the formula (1), R1 represents a hydrogen atom or a monovalent acid-labile group. R2 represents an alicyclic hydrocarbon group having 3 to 20 carbon atoms and a valency of (m+1). m is an integer of 2 to 5. R3 and R4 each independently represent a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. n is an integer of 0 to 5. At least two of a plurality of R1s optionally taken together represent a ring structure, together with a plurality of oxygen atoms bonding to R1 and the carbon atom(s) constituting R2 and bonding to these oxygen atoms. M+ represents a monovalent radiation-degradable onium cation.
Actinic-ray-sensitive or radiation-sensitive resin composition, and resist film using the same, pattern forming method, electronic device manufacturing method, and electronic device, each using the same
-
, (2015/11/16)
Provided are an actinic-ray-sensitive or a radiation-sensitive resin composition with greater residual film ratio and capable of suppressing pattern collapse and an occurrence of bridge defects after development, and a resist film, a pattern forming method, an electronic device manufacturing method, and an electronic device, each using the same. An actinic-ray-sensitive or radiation-sensitive resin composition includes a resin (P) having a repeating unit (a) represented by following General Formula (I), a compound (B) represented by any of following General Formulae (B-1) to (B-3), and a solvent, in General Formula (I), R0 represents a hydrogen atom or a methyl group, and R1, R2 and R3 each independently represent a straight chain or branched alkyl group.
