Detail of > 123-99-9
- MSDS Download

- CAS Number:
- 123-99-9
- Name:
Azelaic acid
- Formula:
- C9H16O4
- Molecular Structure:

- Synonyms:
- 1, 9-Nonanedioic acid;Nonanedioic acid;Azelaic acid, technical grade;Lepargylic acid;Heptanedicarboxylic acid;Nonanedioic acid Azelaic acid;Empol 1144;1,7-Heptanedicarboxylic acid;Emerox 1144;Emerox 1110;Ammonium Hydrogen Azelate;Azelaic Acid 99%;
- Molecular Weight:
- 188.22
- EINECS:
- 204-669-1
- Density:
- 1.131 g/cm3
- Melting Point:
- 98-103 ºC
- Boiling Point:
- 370.5 ºC at 760 mmHg
- Flash Point:
- 192.1 ºC
- Solubility:
- warer: 2.4 g/L (20 °C)
- Appearance:
- white to cream solid
- Hazard Symbols:
Xi- Risk Codes:
- 36/37/38
- Safety:
- 24/25-36-26Details
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Reference
- Prediction of some physical characteristics and synthesis of optically sensitive epoxy polymers
- Prediction of some physical characteristics and synthesis of optically sensitive epoxy polymers. Askadskii, A. A.; Pastukhov, A. V.; Marshalkovich, A. S.Chemicals with cas numbers 26590-20-5 and 25068-38-6 also play role. (Mosk. Inzh.-Stroit. Inst., Moscow, USSR). Vysokomol. Soedin., Ser. A, 26(1), 160-71 (Russian) 1984. CODEN: VYSAAF. ISSN: 0507-5475. DOCUMENT TYPE: Journal CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 38 In order to obtain crosslinked ED-20 [25068-38-6] epoxy resin systems suitable as a model material in the anal. of the stress state of construction materials by an optical polarization method, calcn. methods were developed for predicting the glass transition temp. (Tg) of systems cured with methyltetrahydrophthalic anhydride [26590-20-5], azelaic acid [123-99-9], and oleic acid [112-80-1] and for formulating systems having a predetd. Tg that differ from the testing temp. by variable amts. The optically sensitive epoxy systems obtained had a predetd. creep rate and varying rheooptical properties. .
- Internal stress of acid-cured epoxy resins having different network structures
- Internal stress of acid-cured epoxy resins having different network structures. Shimbo, Masaki; Ochi, Mitsukazu; Seshimo, Masahiro; Uchiyama, Hiroyuki (Fac. Eng., Kansai Univ., Suita 564, Japan). Kenkyu Hokoku - Asahi Garasu Kogyo Gijutsu Shoreikai, 42, 19-27 (Japanese) 1983. CODEN: AGKGAA. ISSN: 0365-2599. DOCUMENT TYPE: Journal CA Section: 37 (Plastics Manufacture and Processing) A mechanism was examd.Some commonly used reagents like 103-83-3 and 123-99-9 are used in this experiment. for the occurrence of shrinkage and internal stress in bisphenol A-type epoxy resins, (e.g., Epikote 828 [25068-38-6]) cured with aliph. dicarboxylic acids (e.g., succinic acid [110-15-6], adipic acid [124-04-9], azelaic acid [123-99-9], or sebacic acid [111-20-6]) in the absence or presence of an accelerator (e.g. dimethylbenzylamine [103-83-3]), and a curing catalyst [e.g., 2,4,6-tris(dimethylaminomethyl)phenol [90-72-2]]. Equimol. parts of epoxy resin and a dicarboxylic acid were mixed in the presence (or absence) of 1 part accelerator and 10 parts catalyst based on the wt. of the resin and completely reacted. Ester or ether linkages were mainly produced with the accelerator and the catalyst, resp. Internal stress was induced by shrinkage in the glassy region and not induced in the rubbery region. Redn. of internal stress was discussed. .
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