Reference

Epoxy resin compositions

Epoxy resin compositions. (Toshiba Corp., Japan). Jpn. Kokai Tokkyo Koho JP 58174417 A2 13 Oct 1983 Showa, 5 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08G059-68; C08G059-40; H01B003-40. APPLICATION: JP 82-56643 7 Apr 1982. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) The title compns. consist of an epoxy compd. contg. 31 epoxy group, a (b-keto esterato)aluminum compd., and bis(hydroxyphenyl) sulfone. The compns. are very stable at room temp. and cure rapidly at 350°, and the cured material shows excellent heat resistance and mech. and elec. properties. Thus, an epoxy resin compn. was prepd. from Epikote 828 [25068-38-6] 70, Epikote 1001 30, tris(Et acetoacetato)aluminum [15306-17-9] 3 and bis(4-hydroxyphenyl) sulfone [80-09-1] 6 parts. The compn. showed excellent stability at room temp. and cured at 150°. A cured resin plate showed a very small value (4.5%) of dielec. tangent (tan d, 180°).

Synthesis and physical properties of polyfunctional methacrylates

Synthesis and physical properties of polyfunctional methacrylates. Part 3. Kawaguchi, Minoru; Fukushima, Tadao; Miyazaki, Koji; Horibe, Takashi; Habu, Tetsuya; Sawamura, Naoaki; Nagaoka, Koichi (Dep. Dent. Mater., Fukuoka Dent. Coll., Fukuoka, Japan). Fukuoka Shika Daigaku Gakkai Zasshi, 10(3), 453-60 (English) 1983. CODEN: FSDZD4. ISSN: 0385-0064. DOCUMENT TYPE: Journal CA Section: 35 (Chemistry of Synthetic High Polymers) Bisphenol S [80-09-1] was treated with ClCH2CH2 [107-07-3] to give SO2(C6H4OCH2CH2OH-p)2 [27205-03-4], esterification of which gave a dimethacrylate) [24448-21-3] which was polymd. with Me methacrylate to a copolymer [91490-51-6]. The phys. properties such as compressive strength, elastic modulus, Knoop hardness, and water resistance, of the copolymer increased with increasing diester content, and were better than those of bisphenol A bis[(methacryloyloxy)ethyl] ether-MMA copolymer [55527-51-0].