Rapid Communications
defect states in the material. These defect states could
interstitials, dislocations, etc. If vacancies with lower
specific volume compared to the host lattice are present,
then a net tensile stress prevails in the film. Oxygen
vacancies in ZnO films are expected to cause tensile
strain. Since the net strain in the ZnO films, as deter-
be due to the presence of oxygen vacancies in the
film. The intensity of the green band is greatest for
the Si(111)/ZnO; this shows that the films directly grown
on Si(111) have a greater number of defects and/or oxy-
gen vacancies.
(2)
mined by a decrease in the frequency of E2 mode of
Strain in thin-film systems usually has the following
three origins: (i) the lattice mismatch between the film
and substrate (or buffer layer); (ii) difference in the ther-
mal expansion coefficient of the film and substrate (or
buffer layer); (iii) microstructure/defect related internal
stresses. The lattice mismatch arises due to the differ-
ences in lattice constants between the film and the sub-
strate under epitaxial growth conditions. If the lattice
constant of the film af is less than the lattice parameter of
substrate (af < as), then there is a tensile stress in the
film; on the other hand, if (af > as), then the film is under
compressive strain. Under the lattice matching, total
strain is given by ⑀T ס
2(af − as). Since the in-plane lat-
tice parameter of ZnO is more than that of AlN and GaN
(see Table I), lattice mismatch strain in ZnO is expected
to be compressive in the case of Si(111)/AlN/ZnO and
Si(111)/GaN/ZnO heterostructures. The film directly
grown on Si(111) has random in-plane orientation, and
hence lattice mismatch strain is expected to be absent in
this film. Furthermore, it has been reported that beyond a
critical thickness of the film most of the lattice mismatch
stress gets dissipated in creating dislocations in the film
at the growth temperature. However, as the film cools
down, the thermal strain is developed in the film due to
the difference in the thermal expansion coefficient of the
substrate and the film. If the coefficient of thermal ex-
pansion of the films ␣f is greater than the coefficient
of thermal expansion of the substrate ␣s (␣f > ␣s), then
the thermal strain in the film is expected to be tensile;
on the other hand, if ␣f < ␣s, then the thermal strain will
be compressive in nature. As can be seen in Table I, the
value of the coefficient of thermal expansion of ZnO
along the a–b basal plane is less than those of AlN, GaN,
and Si; this implies that the thermal strain in ZnO film
should be compressive. The third cause of the strain,
namely, the microstructure/defect related internal stress,
is resulting from the trapped point defects like vacancies,
Raman spectra and a red-shift of the band-edge PL peak,
is tensile, we predict that the microstructure/defect re-
lated internal stress is the main source of the strain in
the system.
In conclusion, we have grown and integrated single-
crystal epitaxial ZnO films on Si(111) substrates by em-
ploying AlN and GaN buffer layers in a pulsed laser
deposition process. A thorough investigation of their op-
tical characteristics has been carried out using Raman
scattering and PL experiments. Growth of epitaxial ZnO
films on silicon substrates with a precise understanding
of their optical characteristics provides excellent oppor-
tunity to integrate various functional properties of ZnO
with the silicon-based microelectronics devices.
ACKNOWLEDGMENTS
This work was partially supported by the National Sci-
ence Foundation. The authors thank Prof. R.J. Nemanich
for very useful comments and permission to use the
micro-Raman facilities.
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