Angewandte Chemie - International Edition p. 23583 - 23587 (2020)
Update date:2022-08-16
Topics:
Aubert, Emmanuel
Dhaka, Arun
Espinosa, Enrique
Fourmigué, Marc
Jeannin, Olivier
Jeon, Ie-Rang
Activation of a deep electron-deficient area on chalcogen atoms (Ch=Se, Te) is demonstrated in alkynyl chalcogen derivatives, in the prolongation of the (C≡)C?Ch bond. The solid-state structures of 1,4-bis(methylselenoethynyl)perfluorobenzene (1Se) show the formation of recurrent chalcogen-bonded (ChB) motifs. Association of 1Se and the tellurium analogue 1Te with 4,4′-bipyridine and with the stronger Lewis base 1,4-di(4-pyridyl)piperazine gives 1:1 co-crystals with 1D extended structures linked by short and directional ChB interactions, comparable to those observed with the corresponding halogen bond (XB) donor, 1,4-bis(iodoethynyl)-perfluorobenzene. This “alkynyl” approach for chalcogen activation provides the crystal-engineering community with efficient, and neutral ChB donors for the elaboration of supramolecular 1D (and potentially 2D or 3D) architectures, with a degree of strength and predictability comparable to that of halogen bonding in iodoacetylene derivatives.
View MoreHubei Lansun Biochemical Pharmaceutical Co., Ltd
Contact:714-6395977
Address:No. 81 Pengcheng Avenue, economic and technological development zone, Huangshi City, Hubei Province,China
Shenzhen ZheYi Chemicals Co.,LTD(Shanghai Branch)
Contact:+86-21-54159691
Address:Room1002,Building No.2, Lane 98 Bixiu Road,Minhang District, Shanghai,China 201100
Jiande City Silibase Silicone New Material Manufacture Co., Ltd.
Contact:15967177856
Address:Genglou Industrial Development Area
Jinan Trio PharmaTech Co., Ltd
Contact:86-531-88811783;+(0)13153010282
Address:2766 Yingxiu Road, Jinan High-Tech Zone, China
Shanghai AoBo Bio-Pharmaceutical Technology Co., Ltd.
Contact:+86-21-51320130-801, 816
Address:Room 601, No. 1011, Halei Road, Zhangjiang High-Tech Park, Pudong, Shanghai
Doi:10.1016/0009-2614(80)80109-6
(1980)Doi:10.1021/je00049a015
(1987)Doi:10.1134/S1068162016050046
(2016)Doi:10.1016/j.ejmech.2018.07.045
(2018)Doi:10.1016/j.tetlet.2018.11.063
(2019)Doi:10.1021/ol015933u
(2001)