Z. Dan et al. / Journal of Alloys and Compounds xxx (2013) xxx–xxx
5
obtained in our earlier research on the refinement of nanoporous
References
Cu by adding Au [20,21].
[1] G.C. Bond, D.T. Thompson, Catalysis by gold, Catal. Rev. Sci. Eng. 41 (1999)
319–388.
Even though a similar effect of Ag addition on the refinement of
nanoporous Cu was expected as the Au addition reported before
[20,21], uneven distributions were noted for that of Ag-added al-
loys. In the beginning stage of dealloying, the uniform distribution
of Ag in the amorphous substrates is considered likely to suppress
the diffusion of Cu adatoms effectively indicated by the small pore
sizes. The surface diffusion coefficient of Ag in a vacuum is two or-
ders lower than that of Cu as reported [6,13,17], and the Ag ada-
toms acted as a diffusion barrier for the fast movement of Cu
adatoms in the electrolyte/metal interface region. With increasing
immersion time, more Ag adatoms gradually precipitated on the
ligaments, particularly at the grain boundary. The phase separation
and the presence of the grain boundary and other defects caused
the formation of weak points. From the aspect of the standard elec-
trode potentials, abundant micro-coupling cells formed between
noble Ag phases and Cu–Ag ligaments, which motivated the gal-
vanic dissolution of nanoporous Cu–Ag ligaments. Finally, galvanic
dissolution resulted in the further coarsening of nanoporous Cu–Ag
ligaments and the formation of an excavated structure like the re-
gion marked in Fig. 3. The difference in the surface energy between
Cu (111) and Ag (111) was reported to be 0.74 eV, and that be-
tween Cu (111) and Au (111) was 0.39 eV [25]. This indicates that
the higher driving force resulted in the formation of more Ag phase
than in Au-added amorphous alloys. The large deviation between
the experimental and the theoretical values of the coarsening
exponents in Fig. 4 is thought to be attributed to the combination
of the suppressed diffusion of Cu adatoms in the electrolyte/metal
interface and the electrochemical dissolution of adjacent Cu
around segregated Ag atoms motivated by galvanic couplings.
[2] T. You, O. Niwa, M. Tomita, S. Hirono, Characterization of platinum
nanoparticle-embedded carbon film electrode and its detection of hydrogen
peroxide, Anal. Chem. 75 (2003) 2080–2085.
[3] J.R. Weissmueller, N. Viswanath, D. Kramer, P. Zimmer, R. Wuerschum, H.
Gleiter, Charge-induced reversible strain in a metal, Science 300 (2003) 312–
315.
[4] S.H. Joo, S.J. Choi, K.J. Kwa, Z. Liu, O. Terasaki, R. Ryoo, Ordered nanoporous
arrays of carbon supporting high dispersions of platinum nanoparticles, Nature
412 (2001) 169–172.
[5] Z. Qi, C.C. Zhao, X.G. Wang, J.K. Lin, W. Shao, Z.H. Zhang, X.F. Bian, Formation
and characterization of monolithic nanoporous copper by chemical dealloying
of Al–Cu alloys, J. Phys. Chem. C 113 (2009) 6694–6698.
[6] Z.H. Zhang, Y. Wang, Z. Qi, W.H. Zhang, J.Y. Qin, J. Frenzel, Generalized
fabrication of nanoporous metals (Au, Pd, Pt, Ag, and Cu) through chemical
dealloying, J. Phys. Chem. C 113 (2009) 12629–12636.
[7] W.B. Liu, S.C. Zhang, N. Li, J.W. Zheng, Y.L. Xing, A facile one-pot route to
fabricate nanoporous copper with controlled hierarchical pore size
distributions through chemical dealloying of Al–Cu alloy in an alkaline
solution, Micropor. Mesopor. Mater. 138 (2011) 1–7.
[8] W.B. Liu, S.C. Zhang, N. Li, J.W. Zheng, Y.L. Xing, Microstructure evolution of
monolithic nanoporous copper from dual-phase Al–35 at.% Cu alloy, J.
Electrochem. Soc. 157 (2010) D666–D670.
[9] Z.H. Dan, F.X. Qin, Y. Sugawara, I. Muto, N. Hara, Fabrication of nanoporous
copper by dealloying amorphous binary Ti–Cu alloys in hydrofluoric acid
solutions, Intermetallics 29 (2012) 14–20.
[10] J. Biener, A.M. Hodge, J.R. Hayes, C.A. Volkert, L.A. Zepeda-Ruiz, A.V. Hamza, F.F.
Abraham, Size effects on the mechanical behavior of nanoporous Au, Nano
Lett. 6 (2006) 2379–2382.
[11] J.R. Hayes, A.M. Hodge, J. Biener, A.V. Hamza, Monolithic nanoporous copper by
dealloying Mn–Cu, J. Mater. Res. 21 (2006) 2611–2616.
[12] L.Y. Chen, J.S. Yu, T. Fujita, M.W. Chen, Nanoporous copper with tunable
nanoporosity for SERS applications, Adv. Funct. Mater. 19 (2009) 1221–
1226.
[13] L.H. Qian, M.W. Chen, Ultrafine nanoporous gold by low-temperature
dealloying and kinetics of nanopore formation, Appl. Phys. Lett. 91 (2007).
083105.
[14] G. Kumar, V.K. Tripathi, Anomalous absorption of surface plasma wave by
particles adsorbed on metal surface, Appl. Phys. Lett. 91 (2007) 161503.
[15] J.M. Pitarke, V.M. Silkin, E.V. Chulkov, P.M. Echenique, Theory of surface
plasmons and surface-plasmon polaritons, Rep. Prog. Phys. 70 (2007) 1–87.
[16] G. Kumar, D.B. Singh, V.K. Tripathi, Surface enhanced Raman scattering of a
surface plasma wave, J. Phys. D: Appl. Phys. 39 (2006) 4436–4439.
[17] W.R. Tyson, W. Miller, Surface free energies of solid metals: estimation from
liquid surface tension measurements, Surf. Sci. 62 (1977) 267–276.
[18] J. Erlebacher, An atomistic description of dealloying: porosity evolution, the
critical potential, and rate-limiting behavior, J. Electrochem. Soc. 151 (2004)
C614–C626.
[19] D.V. Pugh, A. Dursun, S.G. Corcoran, Electrochemical and morphological
characterization of Pt–Cu dealloying, J. Electrochem. Soc. 152 (2005) B455–
B459.
[20] Z.H. Dan, F.X. Qin, Y. Sugawara, I. Muto, N. Hara, Fabrication of ultrafine
nanoporous copper by the minor addition of gold, Mater. Trans. 53 (2012)
1765–1769.
4. Conclusions
Cost-effective NPCs with a pore size of 8–55 nm was achieved
by modifying the surface diffusivity by minor Ag addition. Amor-
phous Ti60Cu40, Ti60Cu39Ag1, Ti60Cu38Ag2 alloys were dealloyed in
0.03 M and 0.13 M HF solutions under free immersion conditions.
The residues were confirmed to be nanoporous fcc Cu–Ag alloys
and Ag. The defects, such as phase segregation, grain boundary
and twin boundary, formed during the dealloying and rearrange-
ment of Cu and Ag adatoms. The Ag phase tended to precipitate
along grain boundary. The final nanoporous structure had similar
characteristic pore size and ligament size due to the continuous
excavation of ligaments under the galvanic reaction between Ag
phase and interior Cu–Ag matrix. The surface diffusivity of Ti60Cu40
alloys decreased was more than one order of magnitude lower due
to the Ag addition.
[21] Z.H. Dan, F.X. Qin, Y. Sugawara, I. Muto, N. Hara, Elaboration of nanoporous
copper by modifying surface diffusivity by the minor addition of gold,
Micropor. Mesopor. Mater. 165 (2013) 257–264.
[22] J.M. Dona, J. Gonzalez-Velasco, Mechanism of surface diffusion of gold
adatoms in contact with an electrolytic solution, J. Phys. Chem. 97 (1993)
4714–4719.
[23] S. Curtze, V.-T. Kuokkala, A. Oikari, J. Talonen, H. Hänninen, Thermodynamic
modeling of the stacking fault energy of austenitic steels, Acta Mater. 59
(2011) 1068–1076.
Acknowledgement
[24] E.G. Seebauer, C.E. Allen, Estimating surface diffusion coefficients, Prog. Surf.
Sci. 49 (1995) 265–330.
[25] B.Q. Liu, W. Liu, Z.L. Li, Calculation of the surface energy of fcc-metals with the
empirical electron surface model, Appl. Surf. Sci. 256 (2010) 6899–6907.
This research is partially supported by the Ministry of Educa-
tion, Culture, Sports, Science, and Technology (MEXT) through a
Grant-in-Aid for Young Scientists (B) under Grant No. 24760567.