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Kimoto et al.
spatially-resolved EEL spectra obtained across a region from
the Si substrate to the ALD Al2O3 layer. The background in
each EEL spectrum was subtracted using the power-low
model.6 The interval of each spectrum is 0.28 nm in depth.
We discuss the Al L23 ELNES and its depth profile. The
aforementioned peaks T and O are also observed in the ALD
Al2O3 . One specific feature is that peak O is high on the
upper side of Al2O3 layer and peak T is relatively intense
near the Si substrate. Peak T near the interface is extraordi-
narily high compared to ␥-aluminas. It is known that thermal
treatment eventually transforms amorphous Al2O3 to
␥-alumina,14 but under insufficient thermal treatment such as
the present RTA, tetrahedrally coordinated Al is dominant,
especially near the interface.
We studied the interface layer in terms of Si chemical
bonding based on Si L23 ELNES ͑Fig. 3͒. In the Si substrate,
the Si L23 edge is at 100 eV for the midpoint of edge onset,
and is chemically shifted near the interface by about 5 eV,
which is the same as observed in silicates containing SiO4
tetrahedra6 or in amorphous SiO2 .9,17 Although peak inten-
sities gradually decrease toward the upper side, the Si L23
fine structure does not differ in the amorphous layer. We thus
conclude that an aluminum silicate interface layer is formed,
and Si atoms exist as SiO4 tetrahedra. It is estimated that
aluminum silicate near the interface may cause the difference
in aluminum coordination, because tetrahedrally coordinated
cation is dominant in silica. The aluminum silicate layer is
considered to be grown by the Si oxidation during the ALD
process, therefore this should be minimized to optimize the
growth conditions.12
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