RSC Advances
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mesoporous FMCM-41 content. Further the thermal stability of
polymer composites was also considerably increased with
increasing Si–O–Si linkage. Data resulting from different
experimental studies suggests that the newly developed class of
skeletal modied cyanate ester polymer composites can be used
as
a
potential insulation material for microelectronic
applications.
Acknowledgements
The authors thank DST (Nanomission), SR/NM/NS-18/2010,
New Delhi, Govt. of India, for the nancial support. The
authors also thank Dr K. Gunasekaran, and Mr M. Kesavan,
Department of Crystallography and Biophysics for providing the
NMR facility and Dr S. Balakumar, National Centre for Nano-
science and Nanotechnology, University of Madras, for
providing the HRTEM facility.
Fig. 8 Log–log plot dielectric constants of BCC and BCC/FMCM-41
polymeric nanocomposites.
References
Moreover, the non-polar aliphatic chain intrinsically reduces
the dipoles between the electrodes and signicantly reduces the
dielectric constant throughout the matrix, because the reduc-
tion of polarization between the electrodes inuences the
reduction of capacitance and hence reduces the dielectric
constant. In addition, the increase in weight percentages of
FMCM-41 lowers the value of dielectric constant upto 10 wt%.
Beyond 10 wt% the reverse trend was noticed, due to agglom-
eration of FMCM-41 in the matrix system (Table 1). The
dielectric loss is one the most important factors in interlayer
dielectrics which could contribute to power consumption in
microelectronics. Moreover, the lowest value of dielectric loss
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FMCM-41 polymer nanocomposites indicating that these types
of composite materials can be employed as a potential candi-
dates for next generation microelectronics.
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57766 | RSC Adv., 2014, 4, 57759–57767
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