
Journal of the Electrochemical Society p. 457 - 463 (1985)
Update date:2022-08-26
Topics:
Levy
Gallagher
Contolini
Schrey
Aluminum and aluminum-alloy films are widely used in the metallization of integrated circuits. This study describes the properties of LPCVD (low pressure chemical vapor deposition) Al deposited by the disproportionation of AlCl and Si and SiO//2 substrate
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