M.C.F. Oliveira / Electrochimica Acta 53 (2008) 8138–8143
8139
Table 1
Electroless baths composition and deposition conditions of Pd pure and Pd alloy films on Ni and Cu substrates, respectively
Pd film
Reducing agent (mM)
Pd2+ (mM)
NH3 (in H2O) at 25% (v/v) (cm3)
EDTA (M)
Tdep (◦C)
tdep (min)
Reference
Pd (low T)
Pd (high T)
Pd alloy (low P)
Pd alloy (high P)
27.0
28.0
20.0
10.0
10.0
30
23
11.2
8.8
0.11
0.11
0.01
0.29 M NH4Cl
25
50
50
50
300
50
90
[10]
[11]
[12]
[13]
N2H4
12.0
1.0
10.0
−
H2PO2
90
agent concentration that was approximately double than for depo-
sition of Pd (high T), it was found that on using a lower hydrazine
concentration solution (10 mM), a homogeneous Pd film was not
regularly obtained. Concerning the Pd–P alloys, these membranes
were assigned as Pd alloy (low P) and Pd alloy (high P) because
the main difference on the electroless plating composition was the
hypophosphite ion concentration, and therefore the P content of
the alloy.
The films were prepared using electroless plating bath compo-
sitions and plating conditions described in the literature (Table 1).
Excepting Pd alloy (high P), all of these films have been reported
for H2 purification/separation devices. Time deposition was moni-
tored upon the metal substrate immersion into the plating solution.
Pure Pd and Pd alloy films were deposited on smooth metal discs
of nickel (ꢀ = 5 mm) and copper (ꢀ = 9.1 mm), respectively, which
were previously inserted, under pressure, into a Teflon holder and
polished to mirror finishing with successively finer grades of alu-
mina, down to 0.3 m. This electrode assembly allowed deposition
of Pd film just on one face of the disc and its removal by attack of
acid (for electrothermal analysis) without damage of the electrode
support.
3. Results and discussion
Scanning electron microscopy was carried out to determine the
Pd film thickness and assess the film morphology and uniformity.
Fig. 1 shows that the thickness of the Pd-black film is extremely
uniform (which is a characteristic of electroless deposition) and
approximately the same on the different prepared materials (it
varies from 2.2 to 2.8 m). Regarding pure-Pd films, spherical par-
ticles trapped on the surface were found on Pd (high T) film. Some
of these were not well fixed to the surface, leaving holes behind
it. The formation of these spherical particles is probably related to
an insufficient stability of the deposition bath. It may be generated
within the solution due to its self-decomposition, falling down on
the growing film. Looking at the cross-section of the films it was
observed that both Pd films were dense and compact at the sur-
face, but a porous and spongy structure was found on Pd (low T)
core. This remarkable structure seems to be the end result of a very
low deposition rate.
Concerning Pd alloys films, these also revealed to be dense and
compact, either at the surface, either in the core. However, Pd alloy
(low P) displays some small pinholes on the surface, leaving the
copper substrate uncovered on some surfaces sites. EDS analysis
showed that the high P content film contains about 9.5 at.% of P
and the lower P content film contains about 4.0 at.% of P.
2.2. Characterization of Pd-electroless films
Structural analysis of the films was carried out in a Philips X’Pert
diffractometer by X-ray diffraction using Cu K␣ radiation. The iden-
tification of crystalline phases was done using the JCPDS database
cards. On the SEM/EDS analysis a Philips-FEI Quanta 400 micro-
scope was employed. Atomic force microscopy was used for the
topographic characterization of the Pd-black surface. The mea-
surements were performed in a Nanoscope IIIa Multimode AFM
Microscope (Digital Instruments, Veeco) in tapping mode using
etched silicon probes (RTESP7 NanoprobeTM, Digital Instruments)
with a resonance frequency of about 300 kHz.
Atomic force microscopy allowed looking in more detail the sur-
face morphology of these films, particularly, in a region free of the
high-dimension particles trapped on the surface (Fig. 2). It is clear
that Pd (low T) presents the most irregular surface, displaying a
(Rq). In contrast, Pd alloy (high P) shows Pd particles with the most
uniform grain size and the smoothest surface. Curiously, the same
trend has not been found on evaluating the roughness factor by
electrochemical means [14] (Table 2). This discrepancy seems to
reveal that the surface area is not only dependent on the average
particles height (which determines the rms roughness), but is may
also be ruled by the particles density on the surface. The roughness
factor (rf) was not calculated for Pd alloy (high P) because it was
found that PdO reduction peak overlapped with a non-identified
cathodic peak at rather positive anodic limit potentials (whereas
the anodic dissolution of P probably occurs).
The electrochemical instrumentation consisted of an Autolab
(model 100) potentiostat/galvanostat. Experiments were per-
formed in one compartment cell with a Pt flag and a saturated
calomel electrode (to which the potential is referred) as the counter
and reference electrode, respectively. In the cyclic voltammetric
experiments the potential was initially scanned from the anodic
limit potential in the cathodic direction, at a scan rate of 10 mV s−1
.
The solutions were deaerated with N2 and an oxygen-free nitrogen
atmosphere was kept in the cell during the measurements.
The typical hydrogen loading procedure consisted in applying
a rather negative electrode potential (typically −1.3 or −1.4 V) for
variable time in the 0.1 M NaOH solution. A fresh NaOH solution
was prepared every day from high purity water (Millipore system)
and 99.998% pure NaOH (Aldrich). Following the loading portion
of the experiment, it was applied −0.10 V to discharge hydrogen
incorporated in the Pd film. From the total amount of anodic charge
collected, the H content in the metal was calculated assuming the
discharge of absorbed hydrogen is the only electrolytic reaction at
the working electrode and that hydrogen is quantitatively removed
from the electrode. The amount of Pd in the film was determined
by electrothermal atomisation after dissolving it in an HNO3 + HCl
solution (1:1). Reproducible results were obtained from new pre-
pared electrodes.
It is important to remark that despite electroless deposition
yields a quite low surface roughness in contrast to others deposition
Table 2
Surface characterization parameters of Pd-electroless films (roughness factor, Rq,
particles dimension) and palladium loading
Roughness
factor
Rq (5 × 5 m)
∅ particles
Pd loading
(mg cm−2
(nm)
)
Pd (low T)
Pd (high T)
Pd alloy (low P)
Pd alloy (high P)
5.3
6.1
4.2
–
77
24
21
18
22–106
40–50
8–18
2.8 (0.52)a
2.6 (0.43)a
1.2 (0.28)a
2.2
18–22
a
These values rely on the real surface area of Pd films.