14
M. Umeda et al. / Electrochimica Acta 73 (2012) 10–14
3.4. Optimization of electrode potential for Pt electrodeposition
Acknowledgement
tation spots on the 10 1 nm polymer layer, an optimization
of electrode potential for the electrodeposition will be needed.
By changing the electrode potential between 0.1 and 0.3 V vs
RHE, the Pt deposition was carried out for the same substrate as
that shown in Fig. 6(a). First, the electrode potential was grad-
ually changed from 0.30 to 0.10 V vs RHE. Pt depositon was not
observed at 0.30, 0.20, and 0.15 V vs RHE; however, particu-
late deposition occurred at indentation spots and other sites at
0.10 V vs RHE. This means that the data reproduce the results of
Fig. 6(b).
For the second substrate, the electrode potential was gradually
occur at 0.15, 0.14, and 0.13 V vs RHE. After that, the Pt deposition
occurred only at the indentation spots at 0.12 V vs RHE.
The third one was used for Pt electrodeposition at 0.12 V vs RHE,
again, to ensure the results of the second substrate. Then, the Pt
deposition certainly occurred. Fig. 7(a) and (b) respectively show
an AFM image before the deposition and an SEM image after the
deposition controlled at 0.12 V vs RHE. It is confirmed from the EDS
analysis that the Pt deposition occurs only at the indentation spots.
The deposited particle size is effectively reduced to 30–60 nm in
diameter.
This work was supported by a Grant-in-Aid for Scientific
Research (B, 21360358) from the Japan Society for the Promotion
of Science (JSPS), Japan.
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4. Conclusions
To fabricate an electrocatalyst model, a mask indentation tech-
nique was newly developed to prepare small Pt particles on a glassy
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(1) An electroconductive glassy carbon substrate was overcoated
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with the AFM cantilever. An optimized loading force of 3.6 N
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