C O M M U N I C A T I O N S
Figure 3. (a) Drain current IDS versus source/drain voltage VDS as a function
of gate voltage VG for an illustrative TFT with silver source/drain electrodes
from the silver salt solution (channel length and width are, respectively, 25
Figure 2. Thin-film X-ray diffraction of a silver salt solution annealed at
150 °C for 45 min. Inset is a SEM image of the resulting silver thin film.
and 1340 µm). (b) IDS and (-IDS)
1/2 versus VG at a constant VDS ) -60 V
used for calculation of the mobility and current on/off ratio.
to impede electrical conduction in the film, thus lower electrical
conductivity. With a longer carboxylic acid additive (>C8), a
homogeneous thin film with no discernible crystalline domain
boundaries was formed (Figure 1, inset b), thus the observed higher
electrical conductivity. Shorter-chain acids showed no effects since
they were too volatile and would be evaporated off during
annealing. Longer-chain acids slowed down on silver crystallization,
leading to a more homogeneous silver film containing less but larger
crystalline domains.
Highly conductive silver thin films prepared by this approach
were further characterized using X-ray and SEM analyses (Figure
2). X-ray diffraction displayed diffraction peaks at 2θ ) 38.10,
44.20, 64.34, and 77.39°, which were identical to those of a vacuum-
deposited silver film.8 SEM image showed a continuous silver film
of coalesced silver particles having an average particle size of
50-100 nm.
The performance of solution-processed silver conductors of the
present approach was evaluated as the source/drain electrodes in a
TFT device. Unlike single-layer conductive tracks such as antennas
for RFID tags or conductive lines for electronic interconnects, a
multilayered TFT structure would present a more challenging
environment for evaluating the functional performance of conduc-
tive elements. Poor interfacial contacts and/or intermixing of organic
semiconductor with the silver electrodes during deposition and
annealing would adversely affect the device performance. TFT
devices of a bottom-gate, bottom-contact structural configuration
were built on an n-doped silicon wafer using silver source/drain
electrodes generated from the silver acetate solution and a channel
semiconductor comprised of a spin-coated PQT-12 thin film.2a All
the experimental TFT devices exhibited excellent field-effect
transistor (FET) characteristics, which conformed closely to the
conventional gradual channel model in both the linear and saturated
regimes (Figure 3). The devices provided high FET mobility of
0.10-0.15 cm2 V-1 s-1, high current on/off ratio of 107, close to
zero turn-on voltage, and low threshold voltage of -6 V. These
were similar to those of reference TFTs with vacuum-deposited
gold electrodes2a and were significantly superior to those of
reference TFTs with vacuum-deposited silver electrodes (mobility
of ∼0.06 cm2 V-1 s-1; on/off ratio of 106-107). No contact
resistance was observed with smaller channel TFT devices (∼20
µm) even though it was present in similar devices with vacuum-
deposited silver source/drain electrodes. The absence of contact
resistance is believed to be due to the doping of PQT-12
semiconductor at the electrode/semiconductor interface by the
residual carboxylic acid on the surface of the resultant silver
electrodes.4b
relatively low temperature which is compatible with the structural
and dimensional integrity of commercial plastic substrates. The
silver acetate/hydroxylamine/carboxylic acid/n-butanol solution used
for the preparation of the silver conductor was very stable at room
temperature in the dark as no precipitation in the solution was
observed after being stored for over 6 months.
In conclusion, we have developed a simple approach to a
printable silver conductor for microelectronics. Our silver conduc-
tive features exhibited high electrical conductivity similar to that
of a vacuum-deposited silver conductor, yet worked far more
efficiently as electrodes in TFTs.
Acknowledgment. The authors are grateful to Sandra Gardner
for assistance in recording XRD and SEM images.
Supporting Information Available: Instrumentation, silver precur-
sor formulation, device fabrication. This material is available free of
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This approach is particularly significant for flexible electronics
in that the formation of metallic silver could be accomplished at a
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