S. Ivanov, V. Tsakova / Electrochimica Acta 50 (2005) 5616–5623
5617
As far as the silver anion complexes are concerned, to
our knowledge there is no previous experience on their use
for silver deposition in CP layers. Silver anion complexes,
mostly silver thiosulfate, silver cyanide, silver rodanide and
silver pyrophosphate, are in the rule introduced in galvanic
baths for improving the quality of the silver coatings [17].
However, it turned out that there are no investigations on the
initial stages of electrocrystallization performed in the pres-
ence of these complex anions at simple (not polymer-coated)
metal electrodes. Thus, our choice of a suitable silver anion
complex could not be bound to previous findings on the role
of silver anion complexes for the electrochemical nucleation
and growth kinetics. It was merely based on practical consid-
erations: (i) to keep the pH value of the silver plating solution
low for preserving the polyaniline layer electroactivity, (ii) to
anionic shell and (iii) to use non-toxic chemical compounds.
For these reasons two silver complexes were chosen: silver
thiosulfate being of common use for silver plating (see, e.g.
[18]) and silver–EDTA [19] allowing to keep the pH at a
lower value.
from the negative potential limit (E = −0.2 V) in the positive
The silver thiosulfate plating solution (pH 6.4) was pre-
pared by mixing aqueous solutions of 0.01 M AgNO3,
and 0.04 M Na2S2O3 + 0.5 M KNO3. The silver thio-
sulfate complex—[Ag(S2O3)2]3− has a stability constant
β = 4.2 × 1013. The equilibrium potential of silver in this so-
lutionwasmeasuredtobeE = −0.59 V(versusMSE/K2SO4).
Silver–EDTA plating solutions (pH 4.1) with differ-
ent concentrations (10 mM, 2 mM and 0.4 mM) of the
silver–EDTA complex were prepared by mixing the cor-
responding aqueous solution of AgNO3 with aqueous
solution of 0.02 M Na2C10H14O8N2 (disodium salt of
ethylenediaminetetraacetic acid) + 0.5 M KNO3. The three-
valence silver–EDTA complex—[AgEDTA]3− is the dom-
inating species in these solutions and has a stability con-
stant β = 2.1 × 107. The equilibrium potential of silver in
the 10 mM [AgEDTA]3− solution was measured to be
E = −0.04 V (versus MSE/K2SO4).
Comparative measurements for silver deposition by elec-
trochemical reduction of silver cations were performed in
aqueous solution of 0.01 M AgClO4 and 0.5 M HClO4 (pH
0.3). The equilibrium potential of silver in this solution was
measured to be E = −0.002 V (versus MSE/K2SO4).
Imaging of the silver deposit at PANI-coated electrodes
was performed at a JSM 5300 (Jeol) scanning electron mi-
croscope. In this case platinum plates with surface area of
about 2 cm2 were used as working electrodes.
2. Experimental
All experiments were performed in three-electrode ar-
rangement at room temperature. The electrodes consisted of a
platinum plate counter electrode, a mercury/mercury sulfate
reference electrode and a single-crystal polyfaced platinum
bead, melted in a glass tube, used as working electrode. The
surfaceareaoftheworkingelectrodewasS = 2.3 × 10−3 cm2.
The measurements were performed by means of a com-
puterised potentiostat/galvanostat (AUTOLAB PGSTAT 30,
Ecochemie). Beforeexperimentationtheelectrolytesolutions
were de-aerated by bubbling of argon for at least 15 min. The
argon flux was kept over the solution surface in the course of
all electrochemical measurements.
3. Results and discussion
3.1. Electrodriven silver deposition—comparison
between the three silver plating solutions
The values of the equilibrium potential of silver measured
in the three silver plating solutions show that the use of the sil-
ver thiosulfate anion complex will shift the potential window
for silver electrodeposition by at least 0.6 V in the negative
silver in the silver cations and silver–EDTA anion solutions
differ by only 40 mV, and thus, silver deposition in these two
solutions is expected to occur in one and the same poten-
tial window. This effect is demonstrated in Fig. 1a showing
cyclic voltammetric curves registered in the three silver plat-
ing solutions at PANI layers with one and the same redox
charge. Apart from the significant shift of the silver deposi-
tion potential window in the silver thiosulfate case, another
effect becomes evident: whereas the electrodeposition from
silver cations starts at small overpotentials, the silver crys-
tallization in both silver anion complex solutions requires
significant overpotentials. It is also interesting to note that
the voltammetric curve registered in the [AgEDTA]3− so-
lution shows a shoulder in the cathodic current before the
onset of the silver electrocrystallization wave and a corre-
sponding anodic “peak” overlapped by the much larger silver
The anodic deposition of polyaniline layers occurred in
aqueous solution of 0.1 M aniline and 0.5 M H2SO4 by means
of a pulse potentiostatic procedure [20,21]. The pulse se-
quence consists of rectangular anodic and cathodic pulses
with amplitudes Ea = 1.0 V, Ec = 0.2 V and pulse durations
ta = 0.1 s and tc = 0.1 s. The amount of polymerized mate-
rial and thus the thickness of the PANI layer depend on the
number of applied pulse sequences. The amount of deposited
polyaniline was estimated by measuring the reduction charge
in a potentiodynamic sweep between 0 and 1 V (in 0.5 M
H2SO4 solution). Most of the experiments were performed
at PANI layers with redox charge, Qred of about 20 mC cm−2
.
In the case of electroless silver precipitation the PANI
layer were subjected to “complete” reduction by keeping
the electrodes in supporting electrolyte (0.5 M H2SO4) at
−0.62 V for at least 15 min. After disconnecting the elec-
trodes, they were immediatly dipped in the silver plating so-
lution. The amount of deposited silver was measured in the
same supporting electrolyte by slow oxidation scans starting