A.P. Mousinho et al. / Journal of Alloys and Compounds 495 (2010) 620–624
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Fig. 2. Rms Roughness as a function of the process parameters.
Fig. 1. Scheme of the high-density plasma chemical vapor deposition system. (1)
Planar coil with an electrode shield, (2) pyrex window, (3) electrode, (4) secondary
distributor of gases and (5) main distributor of gases.
For the nanostructured DLC films deposited by HDPCVD, just as
for the deposition of others kinds of carbon films, the growth mech-
anisms for obtaining these films are not totally known. In this work,
we used different surface topographies for obtaining different
kinds of nanostructured DLC films. In this situation the roughness
depends on the surface topography. Films deposited on the ref-
erence samples and on the samples with diamond and graphite
powder, showed less roughness than the DLC films deposited on
the etched surface (plasma etching or wet chemical etching). For
the DLC films deposited on the samples with powders, the rough-
ness increases with the deposition time, and for the films deposited
on the etched samples, the roughness decreases with the deposi-
tion time. The roughness for the plasma etched samples before the
depositions were approximately 150 nm and for the wet chemical
etched samples were approximately 55 nm. In Fig. 3, we compared
atomic force microscope (AFM) images from nanostructured DLC
films deposited by the HDPCVD system. And in Fig. 4, we com-
pared SEM micrographics from these films. These images are from
samples with a deposition time of 4 h. The surface morphologies
of DLC films are very different from each other, and all samples
have different grain size. The different grain sizes are dependent
on the surface topography before the film deposition. Larger grain
size can produce more roughness. Different surface topographies
lead to a different DLC film growth. For example, for the DLC films
deposited on rough surfaces (plasma etching), at first, the atoms are
accumulated in the holes that are existent on the surface substrate,
but they cannot fill all the holes on the surface, in this situation
the roughness is larger for smaller deposition time (for the deposi-
tion time of 1 h, the roughness was 120 nm). When the final time is
increased, the atoms fill the holes and are accumulated around the
islands (formed by the filled holes) and the roughness decreases.
This effect promotes the reduction of the surface energy. This effect
is related to the DLC films growth rates. A smaller surface energy on
the substrate is related to a smoothing effect in the films deposition,
and in this condition, the roughness is smaller, because the atoms
have more easiness to form the DLC films. If the surface energy
is high, the roughness increases, because the atoms need the high
energy to be leagued and to form the film. In this situation, the final
roughness of the DLC films is strongly related to the surface energy
[19,20].
energy of the silicon wafers. Four methods were used for the surface modification of
the samples: diamond powder (<1 m) dispersion (deposition by spinner, 1000 rpm,
3
0 s); graphite powder (<5 m) dispersion (deposition by spinner, 1000 rpm, 30 s);
roughness generated by plasma etching (RIE system, SF6 plasma, 6.67 Pa, 100 W,
2
min); roughness generated by wet chemical etching (one part of fluoridric acid and
◦
nine parts of nitric acid or TMAH (2.5%wt @ 80 C) solution and the reference sub-
strate was only submitted to a chemical cleaning). For each method, the DLC films
were deposited with four different deposition times: 1, 2, 3 and 4 h. After prepa-
ration of the samples, the DLC films were deposited. The parameters of the DLC
films depositions were: 2.00 Pa, 250 W (coil power, RF, 13.56 MHz, remote plasma),
4
0-sccm methane. In these conditions, the deposition rate was 47 ± 1 nm/min. The
deposition rate is independent of the surface topography, and is directly related to
the process conditions. For evaluating the deposition rate, we measured the DLC
thickness, using a Dektak 3030 perfilometry from Sloan-Vecco. For the analyses of
the nanostructured DLC films, we used an AFM microscope model SPM 9500J3 (Shi-
madzu). Each sample was analyzed in the AFM in the tapping mode. For each sample,
we have made 10 analyses: 5 analyses in different areas of 15 m × 15 m and 5 ana-
lyzes in different areas of 5 m × 5 m. The scanning electronic microscope used for
analyzing the DLC films was a FEI NOVAnano400 microscope. We analyzed the sur-
face topography of the samples and the lateral profile after the final deposition. We
analyzed the nanostructured DLC films with a vis–UV Raman Spectroscopy system.
The spectra were collected using a Renishaw micro-Raman 2000 spectrometer on a
4
0× objective with a photo multiplicator. Unpolarized Raman spectra were acquired
−1
at ꢀ = 514.5 nm, the spectral resolution was about 4–6 cm and the power on the
sample was kept well below 1 mW. For calculating the intensities and the areas of
the peaks in the Raman spectra, we have made the deconvolution of these spectra
(
with Gaussian fit), using the Microcal Origin program, with Peak Fitting Mode. The
results obtained are shown in this work.
3
. Results and discussion
High-density plasma is quite for the growth of good quality
nanostructured DLC films. But the properties of these films are
largely dependent on the deposition conditions. The roughness of
the nanostructured DLC films is important, in this situation, because
it is affected by surface topography. Fig. 2 shows the Rms rough-
ness of the nanostructured DLC films deposited by the HDPCVD
system as a function of the deposition time. The Rms roughness
was analyzed in two different sizes in each sample (5 m × 5 m
and 15 m × 15 m) and we made five analyses per size. The mea-
surements were made in this way to check if the DLC roughness
does not change when the analyzed area changes, checking the
data reproducibility. With the AFM analyses we checked if rough-
ness does not change with the analyzed area for the nanostructured
DLC films, and the standard deviation was less than 1%. Observing
Fig. 2, we could see that roughness depends strongly on the surface
topography of the samples and on the final deposition time.
For longer deposition time, the atoms cover every island and
the spaces between one island and another, forming a continuous
film (for the deposition time of 4 h, the roughness was 40 nm). The
same effect occurs with the films deposited on the sample etched
with chemical wet. For the DLC films deposited on the surface
with diamond and graphite powder, the roughness increases with