Journal of the American Chemical Society
COMMUNICATION
Table 1. Electronic and OTFT Characteristics of Solution-
Sheared STQDI Thin Films
suppressed the 3D growth of the grains and forced the grains to
coalesce, leading to less empty space and enhanced mobility.
Intriguingly, we found that the surface treatment of the cover
wafer for pressing plays an important role in the performance of
the resulting devices. A PTS-treated cover wafer exhibited higher
μ, compared to the bare or n-octadecyltrimethoxysilane (OTS)-
treated one (Figure S11 [SI]). This is presumably related to the
difference in the wetting properties of the molecules on the
surface, which affects molecular reorganization during the an-
nealing (Figure S12 [SI]).
In summary, we developed a scalable synthesis of soluble
QDIs and demonstrated a solution fabrication of crystalline,
NIR-absorbing QDI thin films. The swallow tails were used as the
solubilizing agent for the insoluble QDI moiety and could be
subsequently removed by thermal treatment at temperatures
ranging from 350 to 400 ꢀC, sufficiently low to provide QDI 6
without degradation. The pressure-assisted thermal cleavage
significantly reduced the surface roughness and void space of
the resulting films, leading to μ up to 0.088 cm2 V-1 s-1. The
developed method opens up a new route toward the solution-
based fabrication of the crystalline thin films of sparingly soluble
higher rylene diimides.
λmax
Eg
μ
Ion/Ioff
Vt
cmpd annealinga [nm] [eV] [cm2 V-1 s-1
]
[V]
4
5
4
5
before
before
after
684
705
597
609
1.3
1.3
1.1
1.1
2.9 Â 10-5
2.3 Â 103 -19
1.1 Â 10-4
0.088
8.8 Â 103
5
2.5 Â 103 -1.8
4.9 Â 104 -0.5
after
0.061
a The annealings of 4 and 5 were performed at 400 and 370 ꢀC for 1 h
under the pressure of 10 and 20 kPa, respectively.
(UPS) revealed the HOMO levels of -5.4 to -5.6 eV for the
annealed films. This means the LUMO levels of the annealed
films correspond to -4.3 to -4.5 eV, which are located in the
empirical LUMO range for air-stable n-channel operation.6
To investigate the effects of thermal cleavage on the charge
transport, top-contact OTFTs were fabricated with a SiO2
(300 nm)/n-doped Si wafer with the surface modification layer
of phenyltrichlorosilane (PTS). The as-prepared OTFTs before
annealing showed electron mobility (μ) ranging from 10-4 to
10-5 cm2 V-1 s-1, whereas after the thermal cleavage they
’ ASSOCIATED CONTENT
yielded 2-3 orders of magnitude higher μ up to 0.088 cm2 V-1 -1
s .
This indicates that the thermal cleavage of the branched chains
indeed facilitates the molecular packing and thus improves
charge transport. The optimized annealing temperatures of 4
and 5 were 400 and 370 ꢀC, respectively. The solution-sheared
thin films typically yielded 1 order of magnitude higher μ com-
pared to that by spin-coated thin films under pressure, due to
their aligned and crystalline nature. The optimized performance
of solution-sheared OTFTs and the annealing conditions are
listed in Table 1 (for the performance details, see Table S2 and
Figure S4 [SI]). The STQDI TFTs were not as air-stable as other
rylene diimides with similarly low-lying LUMOs.6 In addition,
the solution-sheared OTFTs showed relatively higher air stability
with the same order of magnitude mobility after exposure to air
for a week, while the spin-coated devices degraded more rapidly
with about 1 order of magnitude decrease (Figure S5 [SI]). The
solution-sheared thin films benefit from the kinetic factors due to
the larger crystalline grains. This is consistent with our recent
finding that the film thickness and morphology also impact the
air stability in addition to the LUMO level of the molecule.32
The out-of-plane X-ray diffraction (XRD) measurements of 5
thin films annealed at 370 ꢀC exhibited a sharp primary peak at
2θ = 3.54ꢀ (Figure S6 [SI]). This corresponds to a d(001)-
spacing of 24.94 Å, close to the geometry-optimized molecular
length of 6 (23.7 Å).33 This result indicates that the molecules
adopt an edge-on orientation in the thin films and have favorable
molecular orientations for charge transport between source-to-
drain electrodes. The morphology of as-annealed thin films
showed some portions of a void area and a high roughness
(Figures S7 and S8 [SI]), thereby giving rise to some device-to-
device variations. However, the pressure-assisted thermal clea-
vage substantially improved the performance and uniformity
(Figure S9 [SI]). Upon annealing under a pressure of 20 kPa, the
average mobilities of solution-sheared and spin-coated films of 5
were enhanced by 4-8 times compared to those prepared
without pressure. The roughness of 5 thin films decreased
significantly from 12.8 nm, down to 6.7 nm for 10 kPa and
5.7 nm for 20 kPa (Figure S10 [SI]). The applied pressure
S
Supporting Information. Experimental details, OTFT
b
data, UV-vis spectra, XRD data, optical microscope images,
and AFM images. This material is available free of charge via the
’ AUTHOR INFORMATION
Corresponding Author
martin.koenemann@basf.com; zbao@stanford.edu
’ ACKNOWLEDGMENT
This work was supported by BASF SE and the Sloan Research
Fellowship. J.H.O. acknowledges partial financial support from
Basic Science Research Program through the National Research
Foundation of Korea (NRF) funded by the Ministry of Educa-
tion, Science and Technology (Grant No. 2010-0025292).
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