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15112-89-7

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15112-89-7 Usage

Description

TRIS(DIMETHYLAMINO)SILANE, also known as TDMAS, is an organosilicon compound that serves as a versatile precursor for the deposition of various thin films, including Si oxynitride, carbonitride, nitride, and oxide. It is characterized by its suitable melting point and vapor pressure, which allow for efficient vapor deposition at low substrate temperatures (<150°C).

Uses

Used in Thin Film Deposition Industry:
TRIS(DIMETHYLAMINO)SILANE is used as a vapor deposition precursor for the formation of Si oxynitride, carbonitride, nitride, and oxide thin films. It is favored for its ability to deposit these films at low substrate temperatures, making the process more energy-efficient and cost-effective.
Used in Electronics and Optoelectronics Industry:
TRIS(DIMETHYLAMINO)SILANE is used as a material for creating multicomponent silicon-containing thin films, which are essential in the development of electronic and optoelectronic devices. The low-temperature deposition capability of TDMAS allows for the fabrication of high-quality films without damaging sensitive components.
Used in Solar Energy Industry:
In the solar energy sector, TRIS(DIMETHYLAMINO)SILANE is utilized as a precursor for depositing thin-film solar cells, such as silicon-based or other compound semiconductor materials. The low-temperature deposition process is advantageous for producing high-performance solar cells with minimal thermal stress on the substrate.
Used in Chemical Vapor Deposition (CVD) Processes:
TRIS(DIMETHYLAMINO)SILANE is used as a precursor in CVD processes for depositing various types of thin films with precise control over film composition and properties. Its suitable vapor pressure and melting point make it an ideal candidate for CVD applications in various industries, including electronics, optoelectronics, and solar energy.
Please inquire for quantity, pricing, and packaging options to further explore the potential applications and benefits of TRIS(DIMETHYAMINO)SILANE in your specific industry.

Check Digit Verification of cas no

The CAS Registry Mumber 15112-89-7 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 1,5,1,1 and 2 respectively; the second part has 2 digits, 8 and 9 respectively.
Calculate Digit Verification of CAS Registry Number 15112-89:
(7*1)+(6*5)+(5*1)+(4*1)+(3*2)+(2*8)+(1*9)=77
77 % 10 = 7
So 15112-89-7 is a valid CAS Registry Number.
InChI:InChI=1/C6H18N3Si/c1-7(2)10(8(3)4)9(5)6/h1-6H3

15112-89-7 Well-known Company Product Price

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  • Aldrich

  • (570133)  Tris(dimethylamino)silane  electronic grade, 99.999%

  • 15112-89-7

  • 570133-25G

  • 1,918.80CNY

  • Detail
  • Aldrich

  • (759562)  Tris(dimethylamino)silane  packaged for use in deposition systems

  • 15112-89-7

  • 759562-25G

  • 10,500.75CNY

  • Detail

15112-89-7SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 19, 2017

Revision Date: Aug 19, 2017

1.Identification

1.1 GHS Product identifier

Product name TRIS(DIMETHYLAMINO)SILANE

1.2 Other means of identification

Product number -
Other names Tris(dimethylamido)silane

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:15112-89-7 SDS

15112-89-7Related news

Atomic layer deposition of SiO2 from Tris(dimethylamino)silane and ozone by using temperature-controlled water vapor treatment07/25/2019

Atomic layer deposition of SiO2 from tris(dimethylamino)silane (TDMAS) and ozone as precursors on Si(100) surfaces at near-room temperatures was studied by infrared absorption spectroscopy with a multiple internal reflection geometry. TDMAS can be adsorbed at OH sites on hydroxylated Si surfaces...detailed

Non-heating atomic layer deposition of SiO2 using tris(dimethylamino)silane and plasma-excited water vapor07/24/2019

Non-heating atomic layer deposition of SiO2 is developed using tris(dimethylamino)silane (TDMAS) and plasma-excited water vapor. The plasma-excited water is effective in oxidizing the TDMAS-adsorbed SiO2 surface while leaving OH sites on the growing surface at room temperature for further TDMAS ...detailed

15112-89-7Relevant articles and documents

Aylett,Peterson

, p. 3429,3430-3432 (1964)

METHOD FOR PRODUCING DIALKYLAMINOSILANE

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Paragraph 0076-0078, (2020/05/06)

A method for safely and efficiently producing high-purity dialkylaminosilane. Dialkylamine is fed simultaneously during feeding chlorosilane in the presence of metal to cause reaction. For example, chlorosilane and dialkylamine are fed, and then only dialkylamine is fed to cause reaction, whereby dialkylaminosilane is produced.

Synthetic method for tris(dimethylamino)silane

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Paragraph 0019-0021, (2019/07/16)

A synthetic method for tris(dimethylamino)silane is disclosed. The method includes 1) preparing a reaction vessel and feeding protective gas; 2) cooling the reaction vessel to a temperature between -65 DEG C and -75 DEG C, adding a hydrocarbon solvent into the reaction vessel, then adding an organic lithium metal compound and stirring the mixture at a maintained low temperature; 3) feeding dimethylamine gas into the reaction vessel, and stirring the mixture at a maintained low temperature for 8-10 h to prepare a lithium salt of dimethylamine; and 4) while maintaining the low temperature between -65 DEG C and -75 DEG C, adding trichlorosilane to the reaction vessel, after the addition is finished, allowing the mixture to stand to allow the temperature to slowly rise to room temperature, andstirring the mixture for 8-10 h until the reaction is finished; and 5) performing atmospheric-vacuum distillation after the reaction is finished, and collecting a fraction of 75-80 DEG C/5-10 mmHg toobtain the tris(dimethylamino)silane. The cost and reaction toxicity are reduced, operation is simple, and the target compound can be directly obtained without the need of filtration, is high in purity, and meets high requirements of electronic chemicals on product quality.

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