2438-05-3

Basic information

• Product Name: 4-Propylbenzoic acid
• Synonyms: TIMTEC-BB SBB006558;P-PROPYLBENZOIC ACID;4-PROPYLBENZOIC ACID;4-N-PROPYLBENZOIC ACID;Benzoic acid, 4-propyl-;p-n-Propyl benzoic acid;4-PropylbenzoicAcid,3BaC10H12O2;4-n-Propylbenzoic acid, 98+%
• CAS NO: 2438-05-3
• Molecular Formula: C₁₀H₁₂O₂
• Molecular Weight: 164.2
• Product Categories: Liquid Crystal intermediates;Aromatic Carboxylic Acids, Amides, Anilides, Anhydrides & Salts;Benzoic Acids (Building Blocks for Liquid Crystals);Building Blocks for Liquid Crystals;Functional Materials;C10;Carbonyl Compounds;Carboxylic Acids;99.5%
• Mol File: 2438-05-3.mol
• Article Data: 9

Chemical Properties

• Melting Point: 142-144 °C(lit.)
• Boiling Point: 288.61°C (estimate)
• Flash Point: 133.4 °C
• Appearance: White to yellow/Needles or Crystalline Powder
• Density: 1.0670 (estimate)
• Vapor Pressure: 0.00134mmHg at 25°C
• Refractive Index: 1.5198 (estimate)
• Storage Temp.: Sealed in dry,Room Temperature
• Solubility: very faint turbidity in Methanol
• PKA: 4.37±0.10(Predicted)
• BRN: 1934550
• CAS DataBase Reference: 4-Propylbenzoic acid(CAS DataBase Reference)
• NIST Chemistry Reference: 4-Propylbenzoic acid(2438-05-3)
• EPA Substance Registry System: 4-Propylbenzoic acid(2438-05-3)

Safety Data

• Hazard Codes: Xi,Xn
• Statements: 36/37/38-22
• Safety Statements: 26-37/39
• WGK Germany: 3
• Hazardous Substances Data: 2438-05-3(Hazardous Substances Data)

Usage

Chemical Properties

white to yellow needles or crystalline powder

Uses

4-Propylbenzoic acid was used in the preparation of [2,7-dimethoxy-8-(4-propylbenzoyl)naphthalen-1-yl](4-propylphenyl)-methanone.

InChI:InChI=1/C10H12O2/c1-2-3-8-4-6-9(7-5-8)10(11)12/h4-7H,2-3H2,1H3,(H,11,12)/p-1

Upstream product

• 2932-65-2 1-(4-propylphenyl)ethan-1-one 
• 103-65-1 phenylpropane 
• 412019-75-1 4-[1-(4-methoxy-benzoyl)-propyl]-benzonitrile 
• 81631-63-2 p-(methoxycarbonyl)-n-propylbenzene 
• 124-38-9 carbon dioxide 
• 134150-01-9 4-propylphenylboric acid 
• 201230-82-2 carbon monoxide 
• 645-56-7 4-n-Propylphenol 
• 2785-87-7 2-methoxy-4-n-propylphenol 
• 28785-06-0 4-n-propylbenzaldehyde 
• 87942-08-3 bromo(4-propylphenyl)magnesium 
• 588-93-2 p-bromo-n-propylbenzene 
• 57821-78-0 4-oxo-4-(4-propyl-phenyl)-butyric acid 
• 79-37-8 oxalyl dichloride 

Downstream Products

• 52710-27-7 4-propylbenzoyl chloride 
• 81423-83-8 ethyl 4-n-propylbenzoate 
• 199171-93-2 3-nitro-4-propyl-benzoic acid 
• 102152-68-1 4-(1-Ethyl-but-3-enyl)-benzoic acid methyl ester 
• 82657-70-3 4-n-propylbenzyl alcohol 
• 51725-84-9 Ethyl-(4-propylbenzoyl)-acetat 
• 81631-63-2 p-(methoxycarbonyl)-n-propylbenzene 
• 82885-06-1 4-trans-propylcyclohexylacetonitrile 
• 119488-52-7 1-(trans-4-propylcyclohexyl)ethanone 
• 38289-35-9 trans-4-propylcyclohexane carboxamide 
• 669005-36-1 Oxo-(4-propyl-cyclohexyl)-acetaldehyde 

Relevant articles and documents

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Production of Terephthalic Acid from Corn Stover Lignin

Funneling and functionalization of a mixture of lignin-derived monomers into a single high-value chemical is fascinating. Reported herein is a three-step strategy for the production of terephthalic acid (TPA) from lignin-derived monomer mixtures, in which redundant, non-uniform substitutes such as methoxy groups are removed and the desired carboxy groups are introduced. This strategy begins with the hydro-treatment of corn-stover-derived lignin oil over a supported molybdenum catalyst to selectively remove methoxy groups. The generated 4-alkylphenols are converted into 4-alkylbenzoic acids by carbonylation with carbon monoxide. The Co-Mn-Br catalyst then oxidizes various alkyl chains into carboxy groups, transforming the 4-alkylbenzoic acid mixture into a single product: TPA. For this route, the overall yields of TPA based on lignin content of corn stover could reach 15.5 wt %, and importantly, TPA with greater than 99 % purity was obtained simply by first decanting the reaction mixture and then washing the solid product with water.

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.