Characteristics of high-k dielectric ECR-ALD lanthanum hafnium oxide (LHO) films

Add time:08/12/2019    Source:sciencedirect.com

In this study, we investigated the characteristics of various lanthanum hafnium oxide (LHO) films with different lanthanum (La) concentrations deposited by an electron cyclotron resonance plasma-enhanced atomic layer deposition (ECR-ALD). Tris(isopropyl-cyclopentadienyl)lanthanum (La(iPrCp)3) and tetrakis(ethylmethylamino)hafnium (TEMAHf) were utilized as the La and hafnium (Hf) precursors, respectively. When the La/(La + Hf) atomic percent ratio was 49.1%, the growth rate of the LHO film was 0.5 Å/cycle, with a dielectric constant of 16.3. As the La concentration was increased, the dielectric constant decreased. In addition, we found that a La-hydrate phase (La–O–H) can be easily formed when the La/(La + Hf) is over about 50%.

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